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IC资料

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IC封装资料_电容_0201CG5R6D500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214651.05 MB27页215
IC封装资料_三极管_DMN2300UFD-7-81.pdf
DMN2300UFDDatasheetNumber:DS35443Rev.2-21of7www.diodes.comSeptember2011©DiodesIncorporatedAProductLineofDiodesIncorporatedDMN2300...
2024-12-121465361.96 KB7页263
IC封装资料_电容_GRM188R71E154KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121465944.07 KB30页260
IC封装资料_电容_TMK212BJ475KG-T.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-121464653.27 KB26页217
IC封装资料_电容_T491A226K010AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-1214641.54 MB23页137
IC封装资料_连接器_A2541HWV-25P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-121464815.29 KB16页36
IC封装资料_电感_MLG1005S47NJTD25.pdf
INDUCTORSMay2016��MLG1005S1005[0402inch]**��JIS[EIA]��MLG1005S�MLG��更多资料下载请到五八文库wk....
2024-12-121464420.58 KB16页75
IC封装资料_电感_LQP15MN1N5B02D.pdf
SpecNo.JELF243C-0007P-01P.1/9MURATAMFG.CO.,LTD.ReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQP15MN□□□□02DReferenceSpecification1.Scope...
2024-12-121464245 KB9页250
IC封装资料_电感_YSPI0530-1R5M.pdf
SMDPowerInductors-YSPI0530Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Mol...
2024-12-121463698.99 KB4页60
IC封装资料_电源管理芯片_MCP73832T-2ACI_OT.pdf
2005-2014MicrochipTechnologyInc.DS20001984G-page1MCP73831/2Features:•LinearChargeManagementController:-IntegratedPassTransistor...
2024-12-121463915.7 KB28页89
IC封装资料_电阻_B72520T0300K062.pdf
CTVS�CeramictransientvoltagesuppressorsSMDmultilayervaristors(MLVs),standardseriesSeries/Type:Date:May2017©EPCOSAG2017.Reproduct...
2024-12-1214631.64 MB79页166
IC封装资料_电感_SWPA6045S471MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1214631.32 MB22页11
IC封装资料_电容_0603F683Z500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1214631.26 MB20页293
IC封装资料_连接器_1757242.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12146336.13 MB445页275
IC封装资料_电容_CL10Y474MR5NJNC.pdf
SPECIFICATION(Referencesheet)Supplier:Samsungelectro-mechanicsSamsungP/N:CL10Y474MR5NJNCProduct:Multi-layerCeramicCapacitor...
2024-12-121462264.26 KB3页77
IC封装资料_电容_CC0805MRX5R7BB226.pdf
DATASHEETSURFACEMOUNTMULTILAYERCERAMICCAPACITORSGeneralpurpose&HighcapacitanceClass2,X5R4VTO50V100pFto220µFRoHScompliant&Halogenf...
2024-12-121462921.74 KB19页117
IC封装资料_电容_0402CG5R6D500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214621.05 MB27页246
IC封装资料_电源管理芯片_LTC3788EUH_TRPBF.pdf
LTC378813788fc15nF4.7µF2.7k12.1k12.1kVOUT12VAT5AVOUT24VAT3AVIN4.5VTO12VSTART-UPVOLTAGEOPERATESTHROUGHTRANSIENTSDOWNTO2.5VVIN0.1µ...
2024-12-121461489.26 KB32页156
IC封装资料_电容_CC1206MKX5R5BB476.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1214611.22 MB13页208
IC封装资料_电源管理芯片_LM3940IS-3_3.pdf
ProductFolderOrderNowTechnicalDocumentsTools&SoftwareSupport&CommunityAnIMPORTANTNOTICEattheendofthisdatasheetaddressesavailabilit...
2024-12-1214612.05 MB24页7

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