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IC资料

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IC封装资料_电容_0402B301K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1214611.26 MB20页275
IC封装资料_电容_0201CG0R8B500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214611.05 MB27页187
IC封装资料_三极管_SI2343DS-T1-E3.pdf
VishaySiliconixSi2343DSDocumentNumber:72079S09-0133-Rev.B,02-Feb-09www.vishay.com1P-Channel30-V(D-S)MOSFETFEATURES•Halogen-freeAc...
2024-12-121461287.49 KB9页252
IC封装资料_电容_TAJD107M020RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121461210.32 KB7页247
IC封装资料_电容_GCM21BC72A105KE36L.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-1214615.94 MB73页180
IC封装资料_电容_TAJC335K050RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121461210.32 KB7页65
IC封装资料_电容_CL10C270JB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-1214601.39 MB36页78
IC封装资料_电容_GRM1885C2A4R7CA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121460944.07 KB30页4
IC封装资料_电容_CL10B105MO8NNWC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121460259.58 KB3页78
IC封装资料_电容_0402X224K250CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1214601.26 MB20页130
IC封装资料_电容_0805B273K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1214591.26 MB20页24
IC封装资料_连接器_DF12_3.0_-32DS-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121459288.67 KB11页170
IC封装资料_电容_CC0603KRX7R8BB683.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1214591.22 MB13页225
IC封装资料_电感_LQG15HS1N2S02D.pdf
SpecNo.JELF243B-0010S-01P.1/11MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQG15HS□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-121459361.38 KB11页215
IC封装资料_电感_NLCV32T-R47M-EFR.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-121458249.79 KB16页291
IC封装资料_电容_GCM188R71H122JA37D.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-1214585.94 MB73页250
IC封装资料_电容_0201CG270J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214581.05 MB27页218
IC封装资料_电源管理芯片_78L05-1.pdf
Page:P2-P1Plastic-EncapsulateVoltageRegulatorFEATURESABSOLUTEMAXIMUMRATINGS(Operatingtemperaturerangeapplies)ParameterSymbolValueU...
2024-12-121458355.46 KB2页241
IC封装资料_电容_CL10F224ZO8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F224ZO8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-121458360.68 KB3页141
IC封装资料_连接器_1843839.pdf
https://www.phoenixcontact.com/us/produkte/184383919.10.2012Page1/7Basestrip-MC1,5/6-GF-3,5-1843839Pleasebeinformedthatthedatashow...
2024-12-121458270.13 KB7页215

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