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IC资料

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IC封装资料_电容_TAJD107M020RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121460210.32 KB7页247
IC封装资料_电容_TAJC335K050RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121460210.32 KB7页65
IC封装资料_电容_GRM1885C2A4R7CA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121460944.07 KB30页4
IC封装资料_电容_CL10B105MO8NNWC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121460259.58 KB3页78
IC封装资料_电源管理芯片_LM3940IS-3_3.pdf
ProductFolderOrderNowTechnicalDocumentsTools&SoftwareSupport&CommunityAnIMPORTANTNOTICEattheendofthisdatasheetaddressesavailabilit...
2024-12-1214602.05 MB24页7
IC封装资料_电容_0402X224K250CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1214601.26 MB20页130
IC封装资料_电容_0402B301K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1214601.26 MB20页275
IC封装资料_电容_0201CG0R8B500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214601.05 MB27页187
IC封装资料_电容_CC0603KRX7R8BB683.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1214591.22 MB13页225
IC封装资料_电感_LQG15HS1N2S02D.pdf
SpecNo.JELF243B-0010S-01P.1/11MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQG15HS□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-121459361.38 KB11页215
IC封装资料_电感_SWPA6045S471MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1214591.32 MB22页11
IC封装资料_电容_CL10F224ZO8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F224ZO8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-121458360.68 KB3页141
IC封装资料_电容_0805B273K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1214581.26 MB20页24
IC封装资料_电源管理芯片_LTC3788EUH_TRPBF.pdf
LTC378813788fc15nF4.7µF2.7k12.1k12.1kVOUT12VAT5AVOUT24VAT3AVIN4.5VTO12VSTART-UPVOLTAGEOPERATESTHROUGHTRANSIENTSDOWNTO2.5VVIN0.1µ...
2024-12-121458489.26 KB32页156
IC封装资料_连接器_DF12_3.0_-32DS-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121458288.67 KB11页170
IC封装资料_连接器_1843839.pdf
https://www.phoenixcontact.com/us/produkte/184383919.10.2012Page1/7Basestrip-MC1,5/6-GF-3,5-1843839Pleasebeinformedthatthedatashow...
2024-12-121458270.13 KB7页215
IC封装资料_电感_NLCV32T-R47M-EFR.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-121458249.79 KB16页291
IC封装资料_电容_GCM188R71H122JA37D.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-1214585.94 MB73页250
IC封装资料_电容_0402B105K100NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214571.05 MB27页291
IC封装资料_电容_0201CG270J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214571.05 MB27页218

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