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IC资料

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IC封装资料_电感_LQG15HS1N0S02D.pdf
SpecNo.JELF243B-0010S-01P.1/11MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQG15HS□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-121448361.37 KB11页118
IC资料_S18-2VNLP-2M (BANNER).pdf
DatasheetNextGenerationSelf-containedDC-operatedSensors•Economicalphotoelectricsensorsforcostsensitiveandhighvolumeinstallations...
2024-12-1514481.14 MB10页207
IC封装资料_电容_GRM188R72D102KW07D.pdf
GRM188R72D102KW07_(0603,X7R:EIA,1000pF,DC200V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit...
2024-12-121448800.86 KB25页151
IC封装资料_电容_GRM1885C2A271JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121448944.07 KB30页171
IC封装资料_电容_GRM155R72A272KA01D.pdf
GRM155R72A272KA01_(0402,X7R:EIA,2700pF,DC100V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit...
2024-12-121448970.98 KB30页45
IC封装资料_三极管_PMBF4393_215.pdf
DATASHEETProductspecificationApril1995DISCRETESEMICONDUCTORSPMBF4391;PMBF4392;PMBF4393N-channelFETs更多资料下载请到五八文库wk.58sm...
2024-12-121447438.56 KB9页85
IC封装资料_电容_GCJ188R72A152KA01D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1214474.17 MB96页224
IC封装资料_电容_1206F106M100NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214471.05 MB27页69
IC封装资料_电源管理芯片_TL783CKTTRG3.pdf
+−ProtectionCircuitOUTINVrefR1R2VOVIErrorAmplifierADJOrefR2VV1R1��ProductFolderSample&BuyTechnicalDocumentsTools&So...
2024-12-1214471.15 MB25页239
IC封装资料_电源管理芯片_LTC4002ES8-8.4_PBF.pdf
LTC400214002f,LTCandLTareregisteredtrademarksofLinearTechnologyCorporation.Allothertrademarksarethepropertyoftheirrespectiveowners...
2024-12-121447253.54 KB16页80
IC封装资料_电容_0402CG102J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214471.05 MB27页245
IC封装资料_电感_MLK1005S8N2JT000.pdf
INDUCTORSFebruary2015MultilayerCeramicMLK10051005[0402inch]**DimensionsCodeJIS[EIA]InductorsforHighFrequencyCircuitsMLK1005TypeMLK...
2024-12-121447209.31 KB10页24
IC封装资料_电容_0201CG6R0D500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214471.05 MB27页260
IC封装资料_电容_GCM155R71H152KA37D.pdf
Lsize1.0±0.05mmWsize0.5±0.05mmTsize0.5±0.05mmExternalterminalwidthe0.15to0.35mmDistancebetweenexternalterminalsg0.3mmmin.Sizeco...
2024-12-1214463.22 MB2页238
IC封装资料_电容_GCM155R71E473KA55D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1214464.17 MB96页218
IC封装资料_电容_UHE1E101MED.pdf
215ALUMINUMELECTROLYTICCAPACITORSCAT.8100FPerformanceCharacteristicsltemUHEMiniatureSized,LowImpedance,HighReliabilityLowimpedance...
2024-12-1214461.34 MB5页47
IC封装资料_电源管理芯片_TPS57112QRTERQ1.pdf
PHVINThermalPadBOOTVSENSECOMPTPS57112-Q1ENRT/CLKSS/TRPWRGDC(SS)RtR3C1C(BOOT)C(O)R1R2C(I)VOV(VIN)AGNDGNDR4R5L(O)Efficiency(%)Output...
2024-12-1214461.89 MB45页274
IC封装资料_连接器_1803316.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12144636.13 MB445页145
IC封装资料_连接器_DF12B_3.5_-20DP-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121446288.67 KB11页228
IC封装资料_电容_CL10B334KO8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121446259.58 KB3页275

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