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IC封装资料_电容_TAJE687K006RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121342210.32 KB7页98
IC封装资料_电源管理芯片_TPS65053RGER.pdf
L2EN_DCDC1ENABLEVCCFB_DCDC2PGND2AGNDEN_LDO1ENABLEEN_DCDC2ENABLEVLDO2200mALDOVLDO2VLDO3DCDC1(I/O)STEP-DOWNCONVERTERVINDCDC1/2L1FB_D...
2024-12-1213422.68 MB37页268
IC封装资料_电容_TAJD685M050RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121342210.32 KB7页219
IC封装资料_连接器_532611071.pdf
更多资料下载请到五八文库wk.58sms.comDETAILZ注釈NOTE1.コネクタ53261**19の詳細寸法については図面SD-53261-024をご参照ください。REFERT...
2024-12-121342597.48 KB6页215
IC封装资料_电容_TAJV107K020RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121341210.32 KB7页294
IC封装资料_连接器_1803387.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12134136.13 MB445页65
IC封装资料_电容_CL10C020BB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121341259.58 KB3页127
IC封装资料_电容_TAJB686M010RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121341210.32 KB7页57
IC封装资料_电容_TAJB225M035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121341210.32 KB7页83
IC封装资料_连接器_F0502-B-54-20T.pdf
FPC0.50mmConnectorsF0502-B-XX-20T≥24D更多资料下载请到五八文库wk.58sms.com
2024-12-121341290.85 KB1页31
IC封装资料_电容_GRM1885C1H100FA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121341944.07 KB30页271
IC封装资料_非易失性存储器_MB85RC16PNF.pdf
FUJITSUSEMICONDUCTORDATASHEETCopyright©2011FUJITSUSEMICONDUCTORLIMITEDAllrightsreserved2011.6MemoryFRAM16K(2K×8)BitI2CMB85RC16■...
2024-12-121341222.36 KB20页255
IC封装资料_电容_0402N1R2C500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1213411.26 MB20页268
IC封装资料_电源管理芯片_LT2940IMS_PBF.pdf
LT294012940fTYPICALAPPLICATIONDESCRIPTIONPowerandCurrentMonitorTheLT®2940measuresahighsidecurrentandadiffer-entialvoltage,multipl...
2024-12-121341425.04 KB24页57
IC封装资料_连接器_1755587.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deFeb24,2010ExtractfromtheonlinecatalogMSTBVA2,5/9-GOrderNo.:1755587...
2024-12-121341230.27 KB5页34
IC封装资料_电感_LQW18ANR27G00D.pdf
SpecNo.JELF243A-0024Y-01P.1/11MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQW18AN□□□□00DREFERENCESPECIFICATION1.Scope...
2024-12-121340361.69 KB12页7
IC封装资料_连接器_300R-30P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121340644.26 KB1页115
IC封装资料_电容_CL05X105KA5NQNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-1213407.55 MB84页61
IC封装资料_电容_CC1206KKX7RZBB333.pdf
ProductSpecification–July13,2018V.21DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSMid-voltageNP0/X7R100VTO630V0.47pFto2.2µFRo...
2024-12-121340814.68 KB19页130
IC封装资料_电感_MWSA1004-6R8MT.pdf
SunlordIndusSunloMoldedOperatingFEATUREMetalmaClosedmHalogenAPPLICAServer,GraphicIndustriaPRODUCMWS①①MWSA②041004120...
2024-12-121340319.07 KB8页206

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