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IC资料

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IC封装资料_电容_1210B106K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1212451.05 MB27页244
IC封装资料_电容_GCJ31MR72A224KA01L.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1212454.17 MB96页124
IC封装资料_电源管理芯片_MP8759.pdf
MP875926V,8A,LowIQ,High-Current,Synchronous,Step-DownConverterMP8759Rev.1.1www.MonolithicPower.com14/13/2017MPSProprietaryInformat...
2024-12-121245800.98 KB22页206
IC封装资料_三极管_IRF3205ZPBF.pdf
��www.irf.com1AUTOMOTIVEMOSFETPD-94653BHEXFET®PowerMOSFETVDSS=55VRDS(on)=6.5mΩID=75ASpecificallydesignedforAutomotiv...
2024-12-121244390.95 KB12页183
IC封装资料_三极管_BSH201_215.pdf
ImportantnoticeDearCustomer,On7February2017theformerNXPStandardProductbusinessbecameanewcompanywiththetradenameNexperia.Nexperiais...
2024-12-121244324.18 KB8页296
IC封装资料_电容_CL10C050BB8NFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121244259.58 KB3页131
IC封装资料_电容_CL10C6R2DB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121244316.22 KB3页141
IC封装资料_连接器_A0801AWR-15-F4MB1-R.pdf
A0801AWR-**-F4M*1-*HU2016.09.28QWY-GCCP-0705更多资料下载请到五八文库wk.58sms.com
2024-12-121244334.91 KB1页165
IC封装资料_电感_LQW18AN15NG00D.pdf
SpecNo.JELF243A-0024Y-01P.1/11MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQW18AN□□□□00DREFERENCESPECIFICATION1.Scope...
2024-12-121244333.23 KB11页74
IC封装资料_电感_SDCL1005CR18JTDF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/05/15SunlordIndustrialPark,Dafuyu...
2024-12-121244376.19 KB4页162
IC封装资料_电容_CL10F154ZO8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F154ZO8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121243360.68 KB3页4
IC封装资料_电容_CL10B103KB8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B103KB8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-121243361.14 KB3页239
IC封装资料_电容_CC1206KKX7RCBB472.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1212431.22 MB13页300
IC封装资料_电容_CC0805KRX7RABB472.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1212431.22 MB13页129
IC封装资料_电容_TAJE106M035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121243210.32 KB7页140
IC封装资料_连接器_AFC01-S59FCA-00.pdf
CUSTOMER:CUSTOMERP/N:PARTNAME:PARTNO.:0.5mmPitchH=2.0mmSMT掀盖式DAET:2016.05.08DAET:2016.05.10DAET:2016.05.12李涛设计朱成峰审核朱...
2024-12-1212431.85 MB10页161
IC封装资料_三极管_DMG1013UW-7.pdf
DMG1013UWDocumentnumber:DS31861Rev.3-21of6www.diodes.comSeptember2013©DiodesIncorporatedDMG1013UWP-CHANNELENHANCEMENTMODEMOSFETFe...
2024-12-121242292.6 KB6页10
IC封装资料_电容_CL10C120JB8NNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-1212427.55 MB84页111
IC封装资料_连接器_KF2EDGCR-X-5.0-12P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121242620.86 KB1页15
IC封装资料_电源管理芯片_LTC4353CMS_PBF.pdf
LTC435314353fTypicalapplicaTionFeaTuresDescripTionDualLowVoltageIdealDiodeControllerTheLTC®4353controlsexternalN-channelMOSFETsto...
2024-12-121242325.02 KB16页299

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