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IC资料

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IC封装资料_电感_SDCL1005CR18JTDF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/05/15SunlordIndustrialPark,Dafuyu...
2024-12-121243376.19 KB4页162
IC封装资料_三极管_IRF3205ZPBF.pdf
��www.irf.com1AUTOMOTIVEMOSFETPD-94653BHEXFET®PowerMOSFETVDSS=55VRDS(on)=6.5mΩID=75ASpecificallydesignedforAutomotiv...
2024-12-121243390.95 KB12页183
IC封装资料_电容_CL10C050BB8NFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121243259.58 KB3页131
IC封装资料_电容_CL10C6R2DB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121243316.22 KB3页141
IC封装资料_电容_GCJ31MR72A224KA01L.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1212434.17 MB96页124
IC封装资料_连接器_A0801AWR-15-F4MB1-R.pdf
A0801AWR-**-F4M*1-*HU2016.09.28QWY-GCCP-0705更多资料下载请到五八文库wk.58sms.com
2024-12-121243334.91 KB1页165
IC封装资料_电感_LQW18AN15NG00D.pdf
SpecNo.JELF243A-0024Y-01P.1/11MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQW18AN□□□□00DREFERENCESPECIFICATION1.Scope...
2024-12-121243333.23 KB11页74
IC封装资料_电源管理芯片_LTC1624IS8_TRPBF.pdf
1LTC1624FEATURESDESCRIPTIONUIN-ChannelMOSFETDriveIImplementsBoost,Step-Down,SEPICandInvertingRegulatorsIWideVINRange:3.5Vto36VOper...
2024-12-121242486.85 KB28页190
IC封装资料_电容_CC1206KKX7RCBB472.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1212421.22 MB13页300
IC封装资料_电容_CC0805KRX7RABB472.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1212421.22 MB13页129
IC封装资料_三极管_DMG1013UW-7.pdf
DMG1013UWDocumentnumber:DS31861Rev.3-21of6www.diodes.comSeptember2013©DiodesIncorporatedDMG1013UWP-CHANNELENHANCEMENTMODEMOSFETFe...
2024-12-121242292.6 KB6页10
IC封装资料_连接器_AFC01-S59FCA-00.pdf
CUSTOMER:CUSTOMERP/N:PARTNAME:PARTNO.:0.5mmPitchH=2.0mmSMT掀盖式DAET:2016.05.08DAET:2016.05.10DAET:2016.05.12李涛设计朱成峰审核朱...
2024-12-1212421.85 MB10页161
IC封装资料_电容_TAJE106M035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121241210.32 KB7页140
IC封装资料_电源管理芯片_MP8759.pdf
MP875926V,8A,LowIQ,High-Current,Synchronous,Step-DownConverterMP8759Rev.1.1www.MonolithicPower.com14/13/2017MPSProprietaryInformat...
2024-12-121241800.98 KB22页206
IC封装资料_电容_CL10B103KB8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B103KB8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-121241361.14 KB3页239
IC封装资料_电感_SWPA8040S8R2MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1212411.32 MB22页188
IC封装资料_电容_CL21B106KOQNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21A106KPFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1212401.42 MB36页84
IC封装资料_电容_CL10F154ZO8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F154ZO8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121240360.68 KB3页4
IC封装资料_电容_GRM1555C1H270JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121240920.26 KB29页288
IC封装资料_电容_0603B104K101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1212401.05 MB27页162

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