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IC资料

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IC封装资料_电容_GRM155R71C472KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121189920.26 KB29页291
IC封装资料_电容_GRM1885C1E103JA01D.pdf
GRM1885C1E103JA01_(0603,C0G:EIA,10000pF,DC25V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit...
2024-12-121189943.97 KB30页44
IC封装资料_电容_0805B683K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1211891.26 MB20页83
IC封装资料_连接器_1-292133-4.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121188222.7 KB2页166
IC封装资料_电感_NLV25T-4R7J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121188318.58 KB6页155
IC封装资料_电容_TMK316BJ106KL-T.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-121188653.27 KB26页33
IC封装资料_电容_GRM188R71E103KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121188944.07 KB30页193
IC封装资料_电容_1206B474K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1211881.05 MB27页94
IC封装资料_电容_CL10B273KO8NNNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-121188452.9 KB21页114
IC封装资料_电容_0402B101K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1211881.26 MB20页181
IC封装资料_电容_CC0603GRNPO9BN220.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121188998.46 KB11页34
IC封装资料_连接器_1827949.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12118736.13 MB445页140
IC封装资料_电感_SWPA252012S3R3MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1211871.32 MB22页280
IC封装资料_电源管理芯片_LTC4267CGN_TRPBF.pdf
LTC426714267fcPoweroverEthernetIEEE802.3afPDInterfacewithIntegratedSwitchingRegulatorTheLTC®4267combinesanIEEE802.3afcompliantPow...
2024-12-1211872.08 MB32页7
IC封装资料_电感_SWPA6028S180MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1211871.32 MB22页231
IC封装资料_电源管理芯片_LTC3780EUH_PBF.pdf
LTC37801RevGFormoreinformationwww.analog.comDocumentFeedbackTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTIONHighEfficiency,Synchr...
2024-12-121187452.33 KB30页297
IC封装资料_电源管理芯片_TPS62162DSGR.pdf
22uF1.8V/1A10uF2.2µHTPS62161VINENAGNDPGNDSWVOSPGFB100k(3..17)VProductFolderOrderNowTechnicalDocumentsTools&SoftwareSupport&Commun...
2024-12-1211873.1 MB40页190
IC封装资料_电感_YPRH104R-471M.pdf
SMDPowerInductors-YPRH104RSeries深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●U...
2024-12-121187762.21 KB4页210
IC封装资料_电容_CL31B226KPHNFNE.pdf
1.Model:CL31B226KPHNFNE2.DescriptionPartno.Size(inch(mm))Thickness(mm)TemperaturecharateristicsCapacitancevalueCapacitancetoleranc...
2024-12-121187141.53 KB1页293
IC封装资料_电容_GRM155R71H153KA12D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121187920.26 KB29页69

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