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IC资料

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IC封装资料_电容_GRM155R71C123KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121172920.26 KB29页93
IC封装资料_电容_CL10A226MQMNUBE.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121172259.57 KB3页253
IC封装资料_电感_NLV32T-150J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV32-PF3225[1210inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV32-PFTypeNLV-PFSeries...
2024-12-121172224.35 KB10页2
IC封装资料_电感_MWSA0603-100MT.pdf
SunlordIndusSunloMoldedOperatingFEATUREMetalmaClosedmHalogenAPPLICAServer,GraphicIndustriaPRODUCMWS①①MWSA②041004120...
2024-12-121172319.07 KB8页291
IC封装资料_电容_TMK316BJ225KL-T.pdf
注意■本产品目录所记载的内容为2016年10月之内容。因改良等原因，可能会不经预告而变更记载内容，所以请务必在使用前先确认最新的产品信息...
2024-12-1211711.83 MB52页227
IC资料_HLS27DBB0850C (BANNER).pdf
DatasheetBanner'sHLS27HazardousLocationLEDStripLighthasasturdyaluminumhousingandisencasedinashatterproof,UV-stabilized,polycarbona...
2024-12-151171673.17 KB8页288
IC封装资料_连接器_1804807.pdf
PHOENIXCONTACTInc.,USAPage1/5http://www.phoenixcon.comMar10,2010ExtractfromtheonlinecatalogPC4/3-G-7,62OrderNo.:1804807Thefiguresh...
2024-12-121170248.55 KB5页33
IC封装资料_电源管理芯片_MP1498.pdf
MP1498High-Efficiency,2A,16V,1.4MHzSynchronous,Step-DownConverterMP1498Rev.1.01www.MonolithicPower.com112/18/2012MPSProprietaryInf...
2024-12-121170709.1 KB18页253
IC封装资料_电容_GCJ43DR72J473KXJ1L.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1211694.17 MB96页201
IC封装资料_电源管理芯片_TL431_SOT-23.pdf
Page:P2-P1Plastic-EncapsulateAdjustableReferenceSourceFEATURESTheoutputvoltagecanbeadjustedto36VLowdynamicoutputimpedance,itstypic...
2024-12-121169340.94 KB2页196
IC封装资料_电容_0603B224K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1211691.26 MB20页243
IC封装资料_电容_GMK063BJ104KP-F.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-121168653.27 KB26页51
IC封装资料_三极管_UMW_15N10.pdf
1UMW15N10UMW15N10=20A20UMW15N10UMW15N10UMWRUMW15N10www.umw-ic.com友台半导体有限公司更多资料下载请到五八文库wk.58sms.com220UMW15N10...
2024-12-1211681.91 MB6页9
IC封装资料_三极管_SI2333DDS-T1-GE3.pdf
VishaySiliconixSi2333DDSDocumentNumber:63861S12-0801-Rev.A,16-Apr-12www.vishay.com1Thisdocumentissubjecttochangewithoutnotice.THEP...
2024-12-121168321.77 KB10页145
IC封装资料_三极管_DDTC114ECA-7-F.pdf
DDTC(R1=R2SERIES)CADocumentnumber:DS30329Rev.13-21of5www.diodes.comSeptember2018©DiodesIncorporatedDDTC(R1=R2SERIES)CANPNPRE-BIAS...
2024-12-121168400.24 KB5页94
IC封装资料_电容_CL10C1R8CB81PNC.pdf
●Supplier:Samsungelectro-mechanicsCL10C1R8CB81PNC●Product:Multi-layerCeramicCapacitorCAP,1.8㎊,50V,±0.25㎊,C0G,0603●AEC-Q200Qu...
2024-12-1211685.8 MB36页180
IC封装资料_电容_T491D475K050AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-1211681.54 MB23页157
IC封装资料_电容_CL10B273KB8SFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121168259.58 KB3页6
IC封装资料_电容_TAJE157K016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121167210.32 KB7页130
IC封装资料_电容_GRM188R71A184KA01D.pdf
GRM188R71A184KA01_(0603,X7R:EIA,0.18uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121167962.4 KB30页132

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