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IC资料

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IC封装资料_电容_GRM188R71C153KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121162944.07 KB30页176
IC封装资料_电感_YPRH104R-1R0M.pdf
SMDPowerInductors-YPRH104RSeries深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●U...
2024-12-121162762.21 KB4页128
IC封装资料_电容_1206B103K102NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1211621.05 MB27页258
IC封装资料_电容_CL10X106MP8NRNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121162259.58 KB3页226
IC封装资料_电感_SWPA8040S1R5NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1211621.32 MB22页136
IC封装资料_电容_GCM1555C1HR50BA16D.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-1211625.94 MB73页170
IC封装资料_电源管理芯片_LT1021BCN8-5_PBF.pdf
1LT10211021fcAPPLICATIOSUFEATURESTYPICALAPPLICATIOUDESCRIPTIOUPrecisionReferenceTypicalDistributionofTemperatureDriftOUTPUTDRIFT(p...
2024-12-121162306.35 KB16页233
IC封装资料_电源管理芯片_LTC6655CHMS8-5_PBF.pdf
LTC6655/LTC6655LN1Rev.GFormoreinformationwww.analog.comTYPICALAPPLICATIONDESCRIPTION0.25ppmNoise,LowDriftPrecisionReferencesTheLTC...
2024-12-1211612.42 MB30页203
IC封装资料_电容_CL21C050CBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1211611.45 MB36页7
IC封装资料_电源管理芯片_LT3470AEDDB_TRPBF.pdf
LT3470A13470afbTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTIONMicropowerBuckRegulatorwithIntegratedBoostandCatchDiodesTheLT®347...
2024-12-121160286.26 KB20页82
IC封装资料_电容_CC0603ZRY5V8BB105.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1211601.22 MB13页192
67-23SURSUGSUBC (A-BRIGHT).pdf
2006/10/12NOTES:1.Alldimensionsareinmillimeters(inches).2.Tolerancesare±0.1mm(0.004inch)unlessotherwisenoted.3.Polarityreferringo...
2024-12-111159344.49 KB5页298
IC封装资料_电容_C322J472J30C000.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-1211594.24 MB7页62
IC封装资料_三极管_IRF9530NSTRLPBF.pdf
IRF9530NSPbFIRF9530NLPbFVDSS-100VRDS(on)0.20ID-14A12016-5-27SymbolParameterMax.UnitsID@TC=25°CContinuousDrainCurrent,VGS@-10V...
2024-12-121159899.86 KB11页86
IC封装资料_电源管理芯片_TPS3823-50QDBVRQ1.pdf
−401.00110.9990.998−151035TA−Free-AirTemperature−C°0.9970.9960.9956085NormalizedInputThresholdVoltage−VIT(TA),VIT(25C)°3.3V...
2024-12-1211591.16 MB23页152
IC封装资料_电容_TAJA685K016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121159210.32 KB7页169
IC封装资料_电源管理芯片_NCP717.pdf
©SemiconductorComponentsIndustries,LLC,2015February,2015−Rev.71PublicationOrderNumber:NCP717/DNCP717300mA,Very-LowQuiescentCurre...
2024-12-121159629.47 KB16页296
IC封装资料_连接器_SM06B-GHS-TBT.pdf
GHCONNECTORGHCONNECTORGHCONNECTORGHCONNECTOR1.25mmpitch/DisconnectableCrimpstyleconnectorsEmbossTapeGHCONNECTORGHCONNECTORGHCONNEC...
2024-12-121158661.11 KB4页32
IC封装资料_电感_LQW15AN6N8J00D.pdf
SpecNo.JELF243A-0050AA-01P.1/14MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQW15AN□□□□00DReferenceSpecification1.Scop...
2024-12-121158376.63 KB15页179
IC封装资料_电容_C2012X5R1C106KT0J0E.pdf
COM-GEN-006DELIVERYSPECIFICATIONSPEC.No.C-General-fDATE:Aug,2019ToUpontheacceptanceofthisspec.previousspec.(C2011-0454)shallbeabol...
2024-12-1211581.79 MB37页277

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