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IC封装资料_电容_CL10C330GB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121110316.19 KB3页171
IC封装资料_电源管理芯片_LTC2955IDDB-1_TRMPBF.pdf
LTC295512955faFormoreinformationwww.linear.com/LTC2955LT3008-3.3VOUTVINPBONINTKILLPGDVINSELLTC2955DDB-12955TA01aGNDTMREN3.3V1MR71M...
2024-12-121110374.33 KB22页254
IC封装资料_电感_SDFL2012LR82KTF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/11/15SunlordIndustrialPark,Dafuyu...
2024-12-121110457.75 KB7页90
IC封装资料_电感_SDCL1005CR22JTDF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/05/15SunlordIndustrialPark,Dafuyu...
2024-12-121110376.19 KB4页50
IC封装资料_电容_0402B471K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1211101.05 MB27页198
IC封装资料_电感_MLF1608DR56KTA00.pdf
February2017INDUCTORSFebruary2017MultilayerFerriteMLF16081608[0603inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsMLF1608...
2024-12-121110311.11 KB11页154
IC封装资料_电感_LQW15AN4N3B00D.pdf
SpecNo.JELF243A-0050AA-01P.1/14MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQW15AN□□□□00DReferenceSpecification1.Scop...
2024-12-121110376.63 KB15页249
IC封装资料_电容_0201CG5R1C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1211101.05 MB27页208
IC封装资料_电容_CC0402ZRY5V6BB474.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121109998.46 KB11页138
IC封装资料_电容_UHV1C681MPD6.pdf
216ALUMINUMELECTROLYTICCAPACITORSCAT.8100HUHVHighRippleLowImpedanceLowerimpedanceathighfrequencyrange.Smallercasesizeandhighripple...
2024-12-121109778.56 KB2页160
IC封装资料_电容_TAJE157M016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121109210.32 KB7页271
IC封装资料_连接器_BM28B0.6-50DS2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121109562.52 KB8页290
IC封装资料_电感_YP0403-102M.pdf
SMDPowerInductors-YP0403Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121109776.45 KB5页241
IC封装资料_电容_CL10B104KA8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B104KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,100㎋,25V,±10%,X7R,0603●AEC-Q200Quali...
2024-12-1211095.81 MB36页280
IC封装资料_电感_VLCF5020T-2R2N2R6-3.pdf
INDUCTORSApril2016WoundFerriteVLCF5020-3InductorsforPowerCircuitsVLCF5020-3TypeVLCFSeries更多资料下载请到五八文库wk.58sms.com(2/9)...
2024-12-121109194.02 KB9页95
IC封装资料_电源管理芯片_LT4256-1CS8_PBF.pdf
LT4256-1/LT4256-21425612faAPPLICATIOSUFEATURESTYPICALAPPLICATIOUDESCRIPTIOUTheLT®4256-1/LT4256-2arehighvoltageHotSwapTMcontroller...
2024-12-121109283.94 KB16页109
IC封装资料_电感_MLG1005S3N9BT000.pdf
INDUCTORSMay2016��MLG1005S1005[0402inch]**��JIS[EIA]��MLG1005S�MLG��更多资料下载请到五八文库wk....
2024-12-121109420.58 KB16页195
IC封装资料_电感_SWPA4030S1R0NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1211081.32 MB22页57
IC封装资料_连接器_1757569.pdf
PHOENIXCONTACTInc.,USAPage1/6http://www.phoenixcon.comFeb25,2010ExtractfromtheonlinecatalogMSTBA2,5/12-GOrderNo.:1757569Thefigures...
2024-12-121108231.25 KB6页279
IC封装资料_电容_CC0805JRNPOBBN330.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1211081.22 MB13页247

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