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IC封装资料_电源管理芯片_CJ78L05_TO-92.pdf
2C00.1μFJIANGSUCHANGJIANGELECTRONICSTECHNOLOGYCO.,LTDTO-92EncapsulateThree-terminalVoltageRegulatorCJ78L05Three-terminalpositivev...
2024-12-121104577.04 KB2页250
IC封装资料_电声器件_B4013AM-087.pdf
SpecificationofElectretCondenserMicrophone(RoHSCompliance&Halogen-Free)havesound,willtravelB4013AM-087APVDDESIGNSTANDARDCHKDGoerTe...
2024-12-121104663.34 KB16页287
IC封装资料_连接器_1758115.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12110436.13 MB445页267
IC封装资料_电容_0805B122K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1211041.26 MB20页139
IC封装资料_电容_CL10C3R6CB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121104316.2 KB3页146
IC封装资料_电容_1206B122K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1211041.05 MB27页159
IC封装资料_三极管_BSS138N.pdf
BSS138NSIPMOS®Small-Signal-TransistorFeatures•N-channel•Enhancementmode•Logiclevel•dv/dtrated•Pb-freelead-plating;RoHScompli...
2024-12-121103548.15 KB9页120
IC封装资料_电容_CL10F225ZO8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121103259.58 KB3页69
IC封装资料_电容_CL10A106KP8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121103259.58 KB3页19
IC封装资料_电源管理芯片_LM25116MHX_NOPB.pdf
FBVINVCCRT/SYNCHBENLLM25116COMPAGNDCSGRAMPSSCSPGNDLOVOUTHOSWUVLOVCCXDEMBCSYNCCVCCVINCHBCOUTVOUTRFB2RSCRAMPCSSCHFRTCCOMPRCOMPRUV1RU...
2024-12-1211031.97 MB40页249
IC封装资料_电感_NLV32T-022J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121103325.01 KB6页219
IC封装资料_电容_CC0805KRX7R0BB682.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1211031.22 MB13页86
IC封装资料_电容_CC0805KRX5R7BB225.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1211031.22 MB13页121
IC封装资料_电感_SWPA4030S3R3MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1211021.32 MB22页175
IC封装资料_电感_SDCL1005C10NJTDF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/05/15SunlordIndustrialPark,Dafuyu...
2024-12-121102376.19 KB4页14
IC封装资料_电源管理芯片_UCC27211ADRMR.pdf
0481216202428328121620SupplyVoltage(V)PropagationDelay(ns)TDLRRTDLFFTDHRRTDHFFPWMCONTROLLER+12VISOLATIONANDFEEDBACK+100VSECONDARYS...
2024-12-1211021.79 MB29页89
IC封装资料_电容_TAJD686K025RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121102208.62 KB7页287
IC封装资料_电容_TAJC337K004RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121101210.32 KB7页213
IC封装资料_连接器_DF12B_3.0_-32DP-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121101288.67 KB11页179
IC封装资料_电容_CL10B273KA8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B273KA8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121101334.94 KB2页247

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