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IC封装资料_电容_CC0805JRNPO9BN150.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-12110417.81 MB176页248
IC封装资料_连接器_1758115.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12110336.13 MB445页267
IC封装资料_电容_0805B122K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1211031.26 MB20页139
IC封装资料_三极管_BSS138N.pdf
BSS138NSIPMOS®Small-Signal-TransistorFeatures•N-channel•Enhancementmode•Logiclevel•dv/dtrated•Pb-freelead-plating;RoHScompli...
2024-12-121103548.15 KB9页120
IC封装资料_电源管理芯片_CJ78L05_TO-92.pdf
2C00.1μFJIANGSUCHANGJIANGELECTRONICSTECHNOLOGYCO.,LTDTO-92EncapsulateThree-terminalVoltageRegulatorCJ78L05Three-terminalpositivev...
2024-12-121103577.04 KB2页250
IC封装资料_电容_CC0603GRNPO9BN271.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121103998.46 KB11页146
IC封装资料_电容_CL10F225ZO8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121102259.58 KB3页69
IC封装资料_电感_SWPA6045S560MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1211021.32 MB22页183
IC封装资料_电感_NLV32T-022J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121102325.01 KB6页219
IC封装资料_电容_1206B122K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1211021.05 MB27页159
IC封装资料_电感_VLS4012ET-6R8M.pdf
INDUCTORSApril2016WoundFerriteVLS4012EInductorsforPowerCircuitsVLS4012ETypeVLS-ESeries更多资料下载请到五八文库wk.58sms.com(2/9)IND...
2024-12-121101227.28 KB9页6
IC封装资料_电源管理芯片_LTC3589EUJ-2_TRPBF.pdf
LTC3589/LTC3589-1/LTC3589-213589fhFormoreinformationwww.linear.com/LTC3589TypicalapplicaTionFeaTuresDescripTionapplicaTionsTheLTC...
2024-12-121101769.35 KB50页57
IC封装资料_电感_SDCL1005C10NJTDF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/05/15SunlordIndustrialPark,Dafuyu...
2024-12-121101376.19 KB4页14
IC封装资料_电源管理芯片_LM25116MHX_NOPB.pdf
FBVINVCCRT/SYNCHBENLLM25116COMPAGNDCSGRAMPSSCSPGNDLOVOUTHOSWUVLOVCCXDEMBCSYNCCVCCVINCHBCOUTVOUTRFB2RSCRAMPCSSCHFRTCCOMPRCOMPRUV1RU...
2024-12-1211011.97 MB40页249
IC封装资料_电容_CC0805KRX7R0BB682.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1211011.22 MB13页86
IC封装资料_电容_CC0805KRX5R7BB225.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1211011.22 MB13页121
IC封装资料_电容_CL10A106KP8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121100259.58 KB3页19
AB-33G1-6V-E (A-BRIGHT).pdf
AAA---BBBRRRIIIGGGHHHTTTA-BRIGHTINDUSTRIALCO.,LTD.A-BRIGHT10/30/20061MULTILAMPSLEDBULBDataSheetFeature:HighefficiencyLEDmaterialsa...
2024-12-111100183.4 KB3页142
IC封装资料_数据转换器_AD5668BRUZ-2REEL7.pdf
Octal,12-/14-/16-Bit,SPIVoltageOutputdenseDACwith5ppm/°C,On-ChipReferenceDataSheetAD5628/AD5648/AD5668Rev.JDocumentFeedbackInform...
2024-12-1211001.04 MB30页195
IC封装资料_三极管_WSD4066DN.pdf
WSD4066DNwww.winsok.twPage1Dec.2014DualN-ChMOSFETGeneralDescriptionProductSummeryTheWSD4066DNisthehighestperformancetrenchDualN-Ch...
2024-12-1211001.21 MB7页88

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