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IC资料

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IC封装资料_电容_TAJD686K025RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121100208.62 KB7页287
IC封装资料_连接器_DF12B_3.0_-32DP-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121100288.67 KB11页179
IC封装资料_电容_CL10B273KA8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B273KA8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121100334.94 KB2页247
IC封装资料_电容_CL21F225ZOFNNNE.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-1211007.46 MB84页210
IC封装资料_电容_TAJC337K004RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121099210.32 KB7页213
IC封装资料_电容_1206F476M160NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210991.05 MB27页144
IC封装资料_电容_GRM1555C1H6R8BA01D.pdf
GRM1555C1H6R8BA01_(0402,C0G:EIA,6.8pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121098944.3 KB30页96
IC封装资料_连接器_513380274.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121098660.46 KB6页74
IC封装资料_电感_NLCV32T-R33M-EFRD.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-121098249.79 KB16页167
IC封装资料_电容_C1608X5R1A106K080AC.pdf
February2019MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[020...
2024-12-1210981.65 MB57页57
IC封装资料_电感_SWPA4030S3R3MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1210981.32 MB22页175
IC封装资料_电容_CL10X106MO8NRNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10X106MO8NRNC·Product:Multi-layerCeramicCapacitor...
2024-12-1210971.28 MB36页142
IC封装资料_电容_CL10F393ZB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F393ZB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121097360.43 KB3页101
IC封装资料_电源管理芯片_LT8309ES5_TRPBF.pdf
LT830918309faFormoreinformationwww.linear.com/LT8309TypicalapplicaTionFeaTuresDescripTionSecondary-SideSynchronousRectifierDriverT...
2024-12-121097310.24 KB14页141
IC封装资料_电容_CC0805CRNPO9BN8R2.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121097998.46 KB11页205
IC封装资料_电源管理芯片_LT1761IS5-BYP_TRPBF.pdf
LT1761Series11761sffTYPICALAPPLICATIONDESCRIPTION100mA,LowNoise,LDOMicropowerRegulatorsinTSOT-23TheLT®1761seriesaremicropower,low...
2024-12-1210971.21 MB22页253
IC封装资料_电容_0603B201K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210971.05 MB27页269
IC封装资料_电容_CL10C180JB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-1210971.42 MB36页207
IC封装资料_电源管理芯片_UCC27211ADRMR.pdf
0481216202428328121620SupplyVoltage(V)PropagationDelay(ns)TDLRRTDLFFTDHRRTDHFFPWMCONTROLLER+12VISOLATIONANDFEEDBACK+100VSECONDARYS...
2024-12-1210971.79 MB29页89
IC封装资料_电容_CL10C150JB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-1210971.42 MB36页46

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