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IC封装资料_电感_NLCV32T-1R5M-EFR.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-121095249.79 KB16页116
IC封装资料_电阻_0603WAF100LT5E.pdf
DATASHEETProductNameThickFilmChipResistorsPartNameChipCommonSeries01005/0201/0402/0603/0805/1206/1210/1812/2010/2512UniroyalElectr...
2024-12-121094449.6 KB7页193
IC封装资料_电容_GRM188R71H104JA93D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121094944.07 KB30页142
IC封装资料_连接器_1843907.pdf
https://www.phoenixcontact.com/us/products/184390710/28/2014Page1/5Basestrip-MC1,5/13-GF-3,5-1843907Pleasebeinformedthatthedatasho...
2024-12-121094175.34 KB5页274
IC封装资料_电容_C222J224K40C000.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-1210931.98 MB5页69
IC封装资料_电容_1206X106M250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210931.05 MB27页206
IC封装资料_电容_1206CG470J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210931.05 MB27页172
IC封装资料_电感_LQW18AN56NG00D.pdf
SpecNo.JELF243A-0024Y-01P.1/11MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQW18AN□□□□00DREFERENCESPECIFICATION1.Scope...
2024-12-121093333.23 KB11页291
IC封装资料_电感_CLF7045T-100M-D.pdf
＊INDUCTORSJune2018WoundFerriteCLF7045-DInductorsforPowerCircuitsCLF7045-DTypeCLF-DSeries(Forautomobiles)更多资料下载请到五八文库w...
2024-12-121093293.81 KB9页53
IC封装资料_电感_YNR3015-6R8M.pdf
SMDPowerInductors-YNR3015Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121093665.41 KB5页198
IC封装资料_晶振_NX3225SA.pdf
Whenorderingourproducts,specifythemwithan“OrderingCode”thatconsistsofthefollowing:--MIfyouhaveanyqueriesconcerningourstandardfre...
2024-12-121092184.82 KB2页15
IC封装资料_电容_CC0805JRNPO9BN250.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121092998.46 KB11页287
IC封装资料_电源管理芯片_AZ1117D-3.3TRE1.pdf
AZ1117Documentnumber:DS36736Rev.4-21of32www.diodes.comMay2016©DiodesIncorporatedAZ11171ALOWDROPOUTLINEARREGULATORDescriptionTheAZ...
2024-12-121092661.89 KB32页284
IC封装资料_电容_CL10C070CB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121091340.05 KB3页6
IC封装资料_电容_EMK316ABJ226KL-T.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-121091653.27 KB26页120
IC封装资料_连接器_AFC01-S39FCA-00.pdf
CUSTOMER:CUSTOMERP/N:PARTNAME:PARTNO.:0.5mmPitchH=2.0mmSMT掀盖式DAET:2016.05.08DAET:2016.05.10DAET:2016.05.12李涛设计朱成峰审核朱...
2024-12-1210911.85 MB10页12
IC封装资料_电容_GRM1885C2A3R3CA01D.pdf
GRM1885C2A3R3CA01_(0603,C0G:EIA,3.3pF,DC100V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121091944 KB30页179
IC封装资料_电源管理芯片_LTC4002EDD-8.4_TRPBF.pdf
LTC400214002f,LTCandLTareregisteredtrademarksofLinearTechnologyCorporation.Allothertrademarksarethepropertyoftheirrespectiveowners...
2024-12-121091253.54 KB16页17
IC封装资料_电容_GRM1885C1H122JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121090944.07 KB30页93
IC封装资料_电容_GRM155R71E273KA88D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12109010.43 MB296页132

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