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IC资料

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IC封装资料_电容_GRM1555C1H470JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121086920.26 KB29页299
IC封装资料_电源管理芯片_LTC3704EMS_TRPBF.pdf
1LTC37043704fbFEATURESDESCRIPTIOUAPPLICATIOSUTYPICALAPPLICATIOUWideInputRange,NoRSENSETMPositive-to-NegativeDC/DCControllerTheLTC...
2024-12-121086409.08 KB28页81
IC封装资料_电容_0603F153Z500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1210861.26 MB20页132
IC封装资料_电容_GJM1555C1H2R2CB01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12108610.43 MB296页262
IC封装资料_三极管_PDTC114ET_215.pdf
1.Productprofile1.1GeneraldescriptionNPNResistor-EquippedTransistor(RET)familyinsmallSurface-MountedDevice(SMD)plasticpackages.1.2...
2024-12-1210861.37 MB17页144
IC封装资料_电容_TAJB225K020RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121086210.32 KB7页41
IC封装资料_电源管理芯片_TLVH431CDBZR.pdf
VREFInputVIOKProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&CommunityAnIMPORTANTNOTICEattheendofthisdatasheetaddre...
2024-12-1210861.99 MB57页165
IC封装资料_电容_CL10B224KO8VPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121086259.58 KB3页149
IC封装资料_电容_CL10B154KA8VPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B154KA8VPNC●Product:Multi-layerCeramicCapacitorCAP,150㎋,25V,±10%,X7R,0603●AEC-Q200Quali...
2024-12-1210865.82 MB36页300
IC封装资料_电容_GJM0335C1E1R2BB01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12108610.43 MB296页231
IC封装资料_连接器_1727023.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12108536.13 MB445页300
IC封装资料_电容_GRM1885C1H131JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121085944.07 KB30页149
IC封装资料_电容_CC0402CRNPO9BN8R2.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1210851.22 MB13页263
IC封装资料_连接器_0.5K-DX-40PWB.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121085453.69 KB1页196
IC封装资料_电源管理芯片_LTC4357HMS8_PBF.pdf
LTC43574357fdFeaturesapplicationsDescriptionPositiveHighVoltageIdealDiodeControllerTheLTC®4357isapositivehighvoltageidealdiodecon...
2024-12-121085840.98 KB14页250
IC封装资料_电容_C0402C104M8PACTU.pdf
1©KEMETElectronicsCorporation•KEMETTower•OneEastBrowardBoulevardC1006_X5R_SMD•11/9/2018FortLauderdale,FL33301USA•954-766-2800...
2024-12-1210851.41 MB21页64
IC封装资料_电容_0805N471J251CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1210851.26 MB20页161
IC封装资料_连接器_1881655.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/4http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMCV0,5/12-G-2,5OrderNo.:18816...
2024-12-121085220.99 KB4页40
IC封装资料_电源管理芯片_TPS3421ECDRYR.pdf
00.20.40.60.811.21.401234567StandbySupplyCurrent(µA)VCC(V)�40�C+0�C+25�C+85�C+105�C+125�CC001VDDResetGNDMicroprocessor,PMU...
2024-12-1210841.77 MB29页29
IC封装资料_电容_CC0805JRNPOBBN100.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121084998.46 KB11页35

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