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IC封装资料_电感_LQP03TN47NH02D.pdf
SpecNo.JELF243C-0015T-01P.1/12MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQP03TN□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-121081281.03 KB12页239
IC封装资料_电源管理芯片_LTC1871EMS_PBF.pdf
LTC187111871feTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTIONWideInputRange,NoRSENSE™CurrentModeBoost,FlybackandSEPICController...
2024-12-121081602.47 KB36页63
IC封装资料_电容_0805CG681J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210801.05 MB27页227
IC封装资料_电感_NLV25T-680J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV25-PF2520[1008inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV25-PFTypeNLV-PFSeries...
2024-12-121080215.06 KB9页149
IC封装资料_电容_T491A226K006AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-1210801.54 MB23页42
IC封装资料_电容_CL21C270JBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1210801.45 MB36页73
IC封装资料_电容_0201CG390J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210801.05 MB27页219
IC封装资料_电源管理芯片_78M12.pdf
Page:P1-P1Plastic-EncapsulateVoltageRegulatorFEATURESABSOLUTEMAXIMUMRATINGS(Operatingtemperaturerangeapplies)ParameterSymbolValueU...
2024-12-121079833.4 KB1页133
IC封装资料_电容_GRM1885C1H130JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121079944.07 KB30页227
IC封装资料_电容_CC0201JRNPO9BN200.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121079998.46 KB11页228
IC封装资料_连接器_1758131.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12107936.13 MB445页281
IC封装资料_连接器_KF2EDGRM-Y-3.5-13P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121079637.56 KB1页18
IC封装资料_连接器_DF3A-14P-2DSA.pdf
May.1.2021Copyright2021HIROSEELECTRICCO.,LTD.AllRightsReserved.IncaseofconsiderationforusingAutomotiveequipment/devicewhichdemandh...
2024-12-121079222.32 KB1页234
IC封装资料_连接器_1759156.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12107936.13 MB445页288
IC封装资料_连接器_DF12E_3.0_-40DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121078288.67 KB11页56
IC封装资料_电容_GRM1885C1H682JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121078944.07 KB30页239
IC封装资料_电容_UWT1H221MNL1GS.pdf
114ALUMINUMELECTROLYTICCAPACITORSU1W2T314C5160708M9C10L11112G13B14ConfigurationPackagecodeSizecodeCapacitancetolerance(±20%)Rated...
2024-12-121078769.15 KB2页218
IC封装资料_电感_NLV32T-R22J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121078325.01 KB6页277
IC封装资料_电感_NLV25T-022J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121078318.58 KB6页250
IC封装资料_电源管理芯片_MAX6035BAUR25+T.pdf
GeneralDescriptionTheMAX6035isahigh-voltage,precisionmicropowervoltagereference.Thisthree-terminaldeviceisavailablewithoutputvolta...
2024-12-121077861.74 KB15页69

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