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IC封装资料_电源管理芯片_LTC4370CDE_PBF.pdf
LTC437014370fTypicalapplicaTionFeaTuresDescripTionTwo-SupplyDiode-ORCurrentBalancingControllerTheLTC®4370isatwo-supplycurrentshar...
2024-12-121051346.99 KB20页278
IC封装资料_电容_0805B104K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210511.05 MB27页18
IC封装资料_电源管理芯片_LT3759HMSE_TRPBF.pdf
LT375913759fcFormoreinformationwww.linear.com/3759TYPICALAPPLICATIONFEATURESDESCRIPTIONWideInputVoltageRangeBoost/SEPIC/InvertingC...
2024-12-121051529.17 KB32页70
IC封装资料_电源管理芯片_LT3083EQ_PBF.pdf
LT308313083faTYPICALAPPLICATIONDESCRIPTIONAdjustable3ASingleResistorLowDropoutRegulatorTheLT®3083isa3Alowdropoutlinearregulatorth...
2024-12-121051490.18 KB28页132
IC封装资料_电容_GRM1885C1H302JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121051944.07 KB30页279
IC封装资料_电容_CC0402KRX7R9BB103P.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121051998.46 KB11页80
IC封装资料_电感_WPN201610H2R2MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-121050624.92 KB9页46
IC封装资料_电容_0402F105M100NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210501.05 MB27页298
IC封装资料_电源管理芯片_LT1962EMS8_TRPBF.pdf
LT1962Series11962fa1962fbFormoreinformationwww.linear.com/LT1962TypicalapplicaTionDescripTion300mA,LowNoise,MicropowerLDORegulator...
2024-12-121050558.05 KB18页32
IC封装资料_电容_CL10C100DB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121050259.57 KB3页250
IC封装资料_电容_GRM188R72A332KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121050944.07 KB30页51
IC封装资料_连接器_AFC01-S22H1A-00.pdf
更多资料下载请到五八文库wk.58sms.com深圳市钜硕电子有限公司AFC01-S**F**-00
2024-12-1210501.58 MB1页21
IC封装资料_电容_C312A224J4SC000.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-1210492.19 MB4页267
IC封装资料_电容_1206CG6R8C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210491.05 MB27页168
IC封装资料_电感_NLCV32T-470K-EFD.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-121049249.79 KB16页10
IC封装资料_电容_CL10C331JC8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121049259.57 KB3页273
IC封装资料_电源管理芯片_LM5030MM_NOPB.pdf
VINVCCRTSSGNDVFBCOMPCSOUT1OUT2ISOLATEDFEEDBACKLM5030VINVOUTProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&Communit...
2024-12-1210491.36 MB30页135
IC封装资料_电容_0603X225K160CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1210481.26 MB20页236
IC封装资料_电感_MLK1005S1N8ST000.pdf
INDUCTORSFebruary2015MultilayerCeramicMLK10051005[0402inch]**DimensionsCodeJIS[EIA]InductorsforHighFrequencyCircuitsMLK1005TypeMLK...
2024-12-121048209.31 KB10页261
IC封装资料_电源管理芯片_L7812CV.pdf
TO-220FPTO-220D²PAKDPAKFeatures•Outputcurrentupto1.5A•Outputvoltagesof5;6;8;8.5;9;12;15;18;24V•Thermaloverloadprotection•Shor...
2024-12-1210481.19 MB56页81

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