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IC资料

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IC封装资料_电容_0402CG430J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210181.05 MB27页178
IC封装资料_电感_MLG1005S43NJT000.pdf
INDUCTORSMay2016��MLG1005S1005[0402inch]**��JIS[EIA]��MLG1005S�MLG��更多资料下载请到五八文库wk....
2024-12-121018420.58 KB16页82
IC封装资料_电容_TAJC226K010RNJ.pdf
6071119HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121018356.28 KB13页164
IC封装资料_连接器_AFC01-S26FCA-00.pdf
CUSTOMER:CUSTOMERP/N:PARTNAME:PARTNO.:0.5mmPitchH=2.0mmSMT掀盖式DAET:2016.05.08DAET:2016.05.10DAET:2016.05.12李涛设计朱成峰审核朱...
2024-12-1210181.85 MB10页168
IC封装资料_电容_CL31B102KBCNNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31F334ZBCNNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1210181.45 MB36页125
AL-HD034A (A-BRIGHT).pdf
2006/10/11NOTES:1.Alldimensionsareinmillimeters(inches);2.Tolerancesare±0.1mm(0.004inch)unlessotherwisenoted.�SolderingironBasic...
2024-12-111017340.96 KB5页22
IC封装资料_电源管理芯片_UC2842BD1R2G.pdf
©SemiconductorComponentsIndustries,LLC,2013September,2013−Rev.171PublicationOrderNumber:UC3842B/DUC3842B,UC3843B,UC2842B,UC2843B...
2024-12-121017493.32 KB22页297
IC封装资料_连接器_KF127-5.0-9P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121017505.5 KB1页11
IC封装资料_连接器_FH12-12S-1SH_55_.pdf
May.1.2020Copyright2020HIROSEELECTRICCO.,LTD.AllRightsReserved.IncaseofconsiderationforusingAutomotiveequipment/devicewhichdemandh...
2024-12-121017339.76 KB6页64
IC封装资料_电容_CL10A226MQ8NRNL.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-1210177.55 MB84页200
IC封装资料_电感_MLG1005S2N4BT000.pdf
INDUCTORSMay2016��MLG1005S1005[0402inch]**��JIS[EIA]��MLG1005S�MLG��更多资料下载请到五八文库wk....
2024-12-121017420.58 KB16页3
IC封装资料_连接器_SM08B-GHS-TB.pdf
GHCONNECTORGHCONNECTORGHCONNECTORGHCONNECTOR1.25mmpitch/DisconnectableCrimpstyleconnectorsEmbossTapeGHCONNECTORGHCONNECTORGHCONNEC...
2024-12-121016661.1 KB4页260
IC封装资料_电容_CL10B331KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121016259.58 KB3页91
IC封装资料_电容_GRM1885C1H222JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121016944.07 KB30页179
IC封装资料_电容_0201HQ0R4B250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210161.05 MB27页288
IC封装资料_连接器_1727065.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12101536.13 MB445页207
IC封装资料_电容_CC0603JRNPO7BN272.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121015998.46 KB11页143
IC封装资料_电感_LQM21PN4R7MGRD.pdf
ChipInductors(ChipCoils)O05E.pdfApr.28,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-12101512.72 MB434页2
IC封装资料_电容_CL10F683ZB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F683ZB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121015360.2 KB3页229
IC封装资料_电感_SDCL1608C2N7STDF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/05/15SunlordIndustrialPark,Dafuyu...
2024-12-121015376.19 KB4页268

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