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IC资料

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IC封装资料_电感_LQM18FN1R0M00D.pdf
SpecNo.JELF243B-0012L-01P.1/8MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQM18FN□□□□00DREFERENCESPECIFICATION1.ScopeT...
2024-12-121014234.19 KB8页150
IC资料_MQDC1-530RA (BANNER).pdf
DatasheetForusewithPresencePLUSandothervisionsystemsForthelatesttechnicalinformationaboutthisproduct,includingspecifications,dimen...
2024-12-151014514.83 KB6页272
IC资料_SMBPPK6 (BANNER).pdf
LEDSpotLightsforUsewithPresencePLUS®P4SensorsForthelatesttechnicalinformationaboutthisproduct,includingspecifications,dimensions,...
2024-12-151014257.05 KB2页132
IC封装资料_电感_SDCL1608C2N7STDF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/05/15SunlordIndustrialPark,Dafuyu...
2024-12-121014376.19 KB4页268
IC封装资料_连接器_1732720.pdf
https://www.phoenixcontact.com/us/produkte/173272011.10.2012Page1/7PCBterminalblockbase-GMKDSP3/2-7,62-1732720Pleasebeinformedthat...
2024-12-121014178.63 KB7页18
IC封装资料_电感_NLCV25T-4R7M-PF.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-121014249.79 KB16页243
IC封装资料_电源管理芯片_LT1965EMS8E-3.3_PBF.pdf
LT1965Series11965fbFormoreinformationwww.linear.com/LT1965FeaturesapplicationsDescription1.1A,LowNoise,LowDropoutLinearRegulatorTh...
2024-12-1210141.04 MB22页260
IC封装资料_电感_MLK1005S3N9ST000.pdf
INDUCTORSFebruary2015MultilayerCeramicMLK10051005[0402inch]**DimensionsCodeJIS[EIA]InductorsforHighFrequencyCircuitsMLK1005TypeMLK...
2024-12-121014209.31 KB10页159
IC封装资料_电容_0402X475K6R3NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210141.05 MB27页174
IC封装资料_电源管理芯片_TPS73701DRVR.pdf
TPS737xxGNDENFBINOUTVINVOUTOptional1.0F�OFFONProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&CommunityTPS737SBVS06...
2024-12-1210142.38 MB40页288
IC封装资料_电容_CL10C3R9CB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121014316.22 KB3页52
IC封装资料_连接器_AFC11-S55ICA-00.pdf
浙江博众电气有限公司ZHEJIANGBOZHONGELECTRICCO.，LTD承认书SPECIFICATIONFORAPPROVAL客户Customer：产品名Project：规格型号PartNo：贵公...
2024-12-1210141.4 MB10页261
IC封装资料_电感_YP0504-3R3M.pdf
SMDPowerInductors-YP0504Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121014776.58 KB5页231
IC封装资料_电源管理芯片_REF3312AIDCKT.pdf
200180160140120100806040200Dropout�Voltage�(mV)�5�4�3�2�1012345Load�Current�(mA)+125C�+25C��40CR3R2VIN+2.7VEnable(1)...
2024-12-1210141.86 MB39页285
IC封装资料_电容_0805F475M250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210141.05 MB27页97
IC封装资料_电容_GRM1885C1H222JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121014944.07 KB30页179
IC封装资料_三极管_DTC114EETL.pdf
DTC114EseriesNPN100mA50VDigitalTransistor(BiasResistorBuilt-inTransistor)DatasheetllOutlineParameterValueSOT-723SOT-416FLVCC50VIC(...
2024-12-1210132.39 MB12页151
IC封装资料_连接器_BM28B0.6-40DS2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121013562.52 KB8页214
IC封装资料_电容_CC0402KRX5R7BB224.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1210131.22 MB13页122
IC封装资料_电容_CL10B225KP8NFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121013259.58 KB3页210

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