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IC资料

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IC封装资料_连接器_BM28B0.6-58DP2-0.35V_51_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-12967562.52 KB8页211
IC封装资料_电容_CL10C4R7CC81PNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-12966452.9 KB21页270
IC封装资料_电容_GRM155R71H823KE14D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12966920.26 KB29页261
IC封装资料_电容_CL10B154KB8VPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12966259.58 KB3页1
IC封装资料_电容_CC0201KRX5R6BB223.pdf
DATASHEETSURFACEMOUNTMULTILAYERCERAMICCAPACITORSGeneralpurpose&HighcapacitanceClass2,X5R4VTO50V100pFto220µFRoHScompliant&Halogenf...
2024-12-12966921.74 KB19页210
IC封装资料_电容_GRM1555C1H360JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12966920.26 KB29页86
IC封装资料_电感_NLCV32T-2R2M-EF.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-12966249.79 KB16页167
IC封装资料_电容_0402CG200F500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-129651.05 MB27页246
IC封装资料_电容_0603B103J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-129651.05 MB27页231
IC封装资料_连接器_KF120-2.54-12P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12965686.3 KB1页195
IC封装资料_连接器_KF2EDGCVM-X-7.62-12P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12965634.58 KB1页9
IC封装资料_连接器_BM28B0.6-34DS2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-12965562.52 KB8页25
IC封装资料_电源管理芯片_XC6701B502MR-G.pdf
1/35XC6701Series28VOperationHighSpeedVoltageRegulatorswithStand-byFunction■FEATURESMaxOutputCurrent:Morethan150mA(200mAlimit)(VIN...
2024-12-12964753.36 KB35页233
IC封装资料_电容_CL10C5R6BB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12964259.58 KB3页91
IC封装资料_电容_CL10B105KQ8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B105KQ8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-12964361.82 KB3页1
IC封装资料_电容_CL03B102KA3NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL03A225MQ3CRNC·Product:Multi-layerCeramicCapacitor...
2024-12-129641.42 MB36页170
IC封装资料_电容_0805CG561J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-129631.05 MB27页179
IC封装资料_电源管理芯片_LTC3212EDDB_TRPBF.pdf
LTC32123212fbTypicalapplicaTionFeaTuresapplicaTionsDescripTionRGBLEDDriverandChargePumpTheLTC®3212isalownoisechargepumpRGBLEDdriv...
2024-12-12963867.93 KB12页237
IC封装资料_电容_0805B103K251CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-129631.26 MB20页246
IC封装资料_数据转换器_ADS5463IPFP.pdf
1PrecisionEdge®SY89833LMicrel,Inc.M9999-082407hbwhelp@micrel.comor(408)955-1690August2007DESCRIPTION■GuaranteedACperformanceover...
2024-12-12963207.68 KB10页253

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