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IC资料

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IC封装资料_电源管理芯片_LTC3212EDDB_TRPBF.pdf
LTC32123212fbTypicalapplicaTionFeaTuresapplicaTionsDescripTionRGBLEDDriverandChargePumpTheLTC®3212isalownoisechargepumpRGBLEDdriv...
2024-12-12964867.93 KB12页237
IC封装资料_电容_0805B103K251CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-129641.26 MB20页246
IC封装资料_电感_YNR2512-1R5M.pdf
SMDPowerInductors-YNR2512Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12963661.28 KB5页264
IC封装资料_电容_CC0805JRNPO9BN331.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-129631.22 MB13页215
IC封装资料_数据转换器_ADS5463IPFP.pdf
1PrecisionEdge®SY89833LMicrel,Inc.M9999-082407hbwhelp@micrel.comor(408)955-1690August2007DESCRIPTION■GuaranteedACperformanceover...
2024-12-12963207.68 KB10页253
IC封装资料_电容_TAJB226M020RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12963210.32 KB7页131
IC封装资料_电容_1206CG6R0C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-129631.05 MB27页276
AL-103B4C (A-BRIGHT).pdf
AAA---BBBRRRIIIGGGHHHTTTA-BRIGHTINDUSTRIALCO.,LTD.PartNo.AL-103B4CDiffNo.10mmRoundType:LEDLamps2006/9/271Notes:1.Alldimensionsarei...
2024-12-11962311.77 KB5页41
IC封装资料_电感_YNR6045-471M.pdf
SMDPowerInductors-YNR6045Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12962672.55 KB6页221
IC封装资料_电容_GRM1555C1H151GA01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1296210.43 MB296页117
IC封装资料_电源管理芯片_DS1233AZ-15_.pdf
DS1233A3.3VEconoResetwww.maxim-ic.comFEATURESAutomaticallyrestartsmicroprocessorafterpowerfailure1of5122001Monitorspushbuttonf...
2024-12-12962189.75 KB5页199
IC封装资料_电源管理芯片_LP2985AIM5-5.0_NOPB.pdf
ON/OFFCOUT2.2µFLP2985ON/OFFCBYPASS0.01µFGNDINBYPASSOUTVOUTVINCIN1µFProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSuppo...
2024-12-129611.44 MB36页50
IC封装资料_电感_LQW18ANR10G00D.pdf
SpecNo.JELF243A-0024Y-01P.1/11MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQW18AN□□□□00DREFERENCESPECIFICATION1.Scope...
2024-12-12961361.69 KB12页212
IC封装资料_电容_CL10C150JB81PNC.pdf
●Supplier:Samsungelectro-mechanicsCL10C150JB81PNC●Product:Multi-layerCeramicCapacitorCAP,15㎊,50V,±5%,C0G,0603●AEC-Q200Qualifi...
2024-12-129615.8 MB36页273
IC封装资料_电源管理芯片_TPS3839G18DQNR.pdf
100110120130140150160170180190200−40−1510356085Temperature(°C)SupplyCurrent(nA)VDD=1.2VVDD=3.3VVDD=5.0VVDD=6.5VG001VDDRESETGNDT...
2024-12-129611.48 MB34页28
IC封装资料_连接器_AFC01-S04FCA-00.pdf
CUSTOMER:CUSTOMERP/N:PARTNAME:PARTNO.:0.5mmPitchH=2.0mmSMT掀盖式DAET:2016.05.08DAET:2016.05.10DAET:2016.05.12李涛设计朱成峰审核朱...
2024-12-129611.85 MB10页175
IC封装资料_电感_WPN3012H4R7MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-12961624.92 KB9页125
IC封装资料_电容_C1005C0G1H330F050BA.pdf
February2019MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[020...
2024-12-129611.65 MB57页291
IC封装资料_电感_MLG1005S22NJT000.pdf
INDUCTORSMay2016��MLG1005S1005[0402inch]**��JIS[EIA]��MLG1005S�MLG��更多资料下载请到五八文库wk....
2024-12-12961420.58 KB16页263
IC封装资料_电容_GRM1885C1H3R6BA01D.pdf
GRM1885C1H3R6BA01_(0603,C0G:EIA,3.6pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12960944.1 KB30页126

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