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IC封装资料_电容_CC0805JRNPOABN221.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-129141.22 MB13页233
IC封装资料_电容_CC0603JRNPO9BN680.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-1291417.81 MB176页139
IC封装资料_电源管理芯片_LT3027EDD_TRPBF.pdf
1LT30273027faVOUT100µV/DIV20µVRMS3027TA01bAPPLICATIOSUDESCRIPTIOUFEATURESTYPICALAPPLICATIOUDual100mA,LowDropout,LowNoise,Micropo...
2024-12-12913403.76 KB16页219
IC封装资料_电感_MLK1005S22NJT000.pdf
INDUCTORSFebruary2015MultilayerCeramicMLK10051005[0402inch]**DimensionsCodeJIS[EIA]InductorsforHighFrequencyCircuitsMLK1005TypeMLK...
2024-12-12913209.31 KB10页166
IC封装资料_电容_TAJD227M006RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12913210.32 KB7页33
IC封装资料_电感_MLF1608A2R2JTD25.pdf
February2017INDUCTORSFebruary2017MultilayerFerriteMLF16081608[0603inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsMLF1608...
2024-12-12912311.11 KB11页220
IC封装资料_连接器_1830680.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1291236.13 MB445页73
IC封装资料_电容_CL10C331JB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12912316.28 KB3页180
IC封装资料_电容_0402F333M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-129121.05 MB27页33
IC封装资料_电容_GRM1885C1H5R6BA01D.pdf
GRM1885C1H5R6BA01_(0603,C0G:EIA,5.6pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12911944.09 KB30页165
IC封装资料_电感_SWPA8040S3R3MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-129111.32 MB22页180
IC封装资料_电源管理芯片_LTC4008EGN_PBF.pdf
LTC40081RevCFormoreinformationwww.analog.comTYPICALAPPLICATIONDESCRIPTION4A,HighEfficiency,Multi-ChemistryBatteryCharger12.3V,4ALi...
2024-12-12911312.69 KB24页18
IC封装资料_电容_0603N561J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-129111.26 MB20页278
IC封装资料_电感_NLV32T-221J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV32-PF3225[1210inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV32-PFTypeNLV-PFSeries...
2024-12-12911224.35 KB10页143
IC封装资料_电容_AC0805KRX7R9BB104.pdf
85ProductSpecification–July5,2018V.11DATASHEETSURFACEMOUNTMULTILAYERCERAMICCAPACITORSAutomotivegradeNP0/X7R6.3VTO630V0.2pFto2.2µ...
2024-12-129111.06 MB24页270
IC封装资料_电感_YP1005-471M.pdf
SMDPowerInductors-YP1005Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-12911776.32 KB5页75
IC封装资料_电容_RVT0J101M0505-TR.pdf
RVTSeriesHUAHUIStandardproduct标准品Operatingwithwidetemperaturerange-40~+105C適用於-40~+105°C的寬溫範圍Loadlifeof2000hours負荷...
2024-12-129111.08 MB3页149
IC封装资料_电容_T491A475K016AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-129101.54 MB23页106
IC封装资料_电容_GRM155R61E225KE11D.pdf
GRM155R61E225KE11_(0402,X5R:EIA,2.2uF,DC25V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12910923.09 KB29页74
IC封装资料_连接器_1-5103308-3.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12909190.54 KB1页181

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