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IC资料

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IC封装资料_电容_CL10C5R6CB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121891259.58 KB3页160
IC封装资料_电感_YPRH1205-220M.pdf
SMDPowerInductors-YPRH1205Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Hig...
2024-12-121891737.24 KB5页288
IC封装资料_电容_0603B471K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1218911.26 MB20页28
IC封装资料_电源管理芯片_LTC3548EMSE_TRPBF.pdf
LTC354813548fcTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTION■PDAs/PalmtopPCs■DigitalCameras■CellularPhones■PortableMediaPla...
2024-12-121891332.02 KB16页242
IC封装资料_电容_CC1206KKX7R8BB105.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1218911.22 MB13页219
IC封装资料_电容_CC0805JRNPO9BN360.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121891998.46 KB11页97
IC封装资料_电源管理芯片_LT3650EDD-8.4_TRPBF.pdf
LT3650-8.2/LT3650-8.4136508284fdTypicalapplicaTionTheLT®3650isacompletemonolithic2-cellLi-Ion/Polymerbatterychargerthatoperatesov...
2024-12-121890362.48 KB22页198
IC封装资料_电容_0603B182K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1218901.26 MB20页146
IC封装资料_电容_GRM1555C1H221JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121890920.26 KB29页252
IC封装资料_电源管理芯片_MAX17225ELT+T.pdf
GeneralDescriptionTheMAX17220–MAX17225isafamilyofultra-lowquiescentcurrentboost(step-up)DC-DCconverterswitha225mA/0.5A/1Apeakindu...
2024-12-121890992.67 KB23页91
IC封装资料_电容_0805B502K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1218901.05 MB27页155
IC资料_HLS27DRR0145C (BANNER).pdf
DatasheetBanner'sHLS27HazardousLocationLEDStripLighthasasturdyaluminumhousingandisencasedinashatterproof,UV-stabilized,polycarbona...
2024-12-151890673.17 KB8页39
IC封装资料_电容_GRM188R61C106KAALD.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121890944.07 KB30页114
IC封装资料_电感_YSPI1040-2R2M.pdf
SMDPowerInductors-YSPI1040Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●M...
2024-12-121890702.46 KB5页41
IC封装资料_电容_CL10C151JB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-1218891.42 MB36页212
IC封装资料_电容_CL10B224KO8NNWC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B224KO8NNWC·Product:Multi-layerCeramicCapacitor...
2024-12-1218891.48 MB36页23
IC封装资料_电感_NR8040T100M.pdf
20REMINDERSNoticeforTAIYOYUDENproductsPleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.■ProductInformationinthisCatalogProduc...
2024-12-121889883.59 KB25页2
IC封装资料_电感_NLV32T-6R8J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV32-PF3225[1210inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV32-PFTypeNLV-PFSeries...
2024-12-121889224.35 KB10页267
IC封装资料_连接器_1755752.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12188936.13 MB445页207
IC封装资料_电源管理芯片_MCP1700T-3302E_TT.pdf
2005-2018MicrochipTechnologyInc.DS20001826E-page1MCP1700Features•AEC-Q100QualifiedandPPAPCapable•1.6µATypicalQuiescentCurrent...
2024-12-1218881.33 MB30页230

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