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IC资料

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IC封装资料_电源管理芯片_TPS79933DDCR.pdf
TPS799xxGNDENNRINOUTVINVOUTOptionalinputcapacitor.Mayimprovesourceimpedance,noise,orPSRR.Optionalbypasscapacitortoreduceoutputnois...
2024-12-128942.18 MB44页81
IC封装资料_电容_UCD1E101MCL1GS.pdf
132UUUUA247jCD(φ4toφ8×6.2)(φ12.5toφ18)(φ8×10,φ10)0.3MAX.φD±0.5B±0.2A±0.2A±0.2C±0.20.5MAX.EHH0.3MAX.φD±0.5B±0.2A±...
2024-12-12894817.62 KB2页106
IC封装资料_电源管理芯片_TPS54302DDCR.pdf
OutputCurrent(A)Efficiency(%)01020304050607080901000.0010.010.11D100VIN=12V,VOUT=5VVIN=12V,VOUT=3.3VVIN=24V,VOUT=5VVIN=24V,VOUT=3....
2024-12-128941.79 MB28页262
IC封装资料_电感_YSPI0530-150M.pdf
SMDPowerInductors-YSPI0530Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Mol...
2024-12-12894698.99 KB4页198
IC封装资料_电容_TAJB106K020RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12894210.32 KB7页188
IC封装资料_连接器_1888690.pdf
https://www.phoenixcontact.com/us/produkte/188869021.12.2012Page1/6PCBterminalblock-MKDSN2.5/3-5.08-1888690Pleasebeinformedthatthe...
2024-12-12893198.32 KB6页228
IC封装资料_电源管理芯片_LP2989AIM-5.0_NOPB.pdf
ProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&CommunityLP2989SNVS083O–FEBRUARY2005–REVISEDMARCH2015LP2989Microp...
2024-12-128931.69 MB34页220
IC封装资料_电容_CC0603KRX7R8BB154.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-128931.22 MB13页297
IC封装资料_电感_MLF2012A1R0KT000.pdf
February2017INDUCTORSFebruary2017积层铁氧体MLF20122012[0805inch]**表示尺寸代码。JIS[EIA]普通电路用电感器MLF2012型MLF系列更多资料下...
2024-12-12893441.86 KB11页75
IC封装资料_电感_MCL1608S100MT.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/04/15SunlordIndustrialPark,Dafuyu...
2024-12-12893275.63 KB3页82
IC封装资料_电感_LQG15HNR12J02D.pdf
SpecNo.JELF243B-0009Q-01P.1/10MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQG15HN□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-12893245.58 KB10页147
IC封装资料_电容_CC0402KRX7R9BB222.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-1289317.81 MB176页246
IC封装资料_电感_SWPA6028S2R2NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-128931.32 MB22页56
IC封装资料_电容_CC1206ZKY5V6BB226.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-128931.22 MB13页24
IC封装资料_电容_0603F563M500NT.pdf
IC封装资料_电容_0603F563M500NT.pdf
2024-12-12893534.29 KB1页114
IC封装资料_电容_0402B822K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-128931.26 MB20页94
IC封装资料_电容_CL21B475KQFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B475KQFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-12892361.75 KB3页29
IC封装资料_电容_GRM155R71E123KA61D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12892920.26 KB29页79
IC封装资料_电感_WPN4020H4R7MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-12892624.92 KB9页82
IC封装资料_电容_0603CG101J201NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128921.05 MB27页62

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