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IC资料

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IC封装资料_电感_YNR6045-252M.pdf
SMDPowerInductors-YNR6045Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12852672.55 KB6页72
IC封装资料_电源管理芯片_LTC3400BES6_TRPBF.pdf
LTC3400/LTC3400B13400faIPagersIMP3PlayersIDigitalCamerasILCDBiasSuppliesIHandheldInstrumentsIWirelessHandsetsIGPSReceiversIUpto92%...
2024-12-12852301.87 KB12页212
IC封装资料_电容_0201B222K160NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128521.05 MB27页300
IC封装资料_三极管_BSP170PH6327XTSA1.pdf
BSP170PSIPMOS®Small-Signal-TransistorFeatures•P-Channel•Enhancementmode•Avalancherated•dv/dtrated•Pb-freeleadplating;RoHScom...
2024-12-12851660.46 KB9页2
IC封装资料_电容_CL10C5R6DB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12851259.58 KB3页110
IC封装资料_连接器_1935213.pdf
https://www.phoenixcontact.com/us/products/193521308/04/2015Page1/6PCBterminalblock-PT1,5/7-5,0-H-1935213Pleasebeinformedthattheda...
2024-12-12851172.23 KB6页13
IC封装资料_电容_GRM1885C1H6R2CA01D.pdf
GRM1885C1H6R2CA01_(0603,C0G:EIA,6.2pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12851944.1 KB30页248
IC封装资料_电感_SWPA5040S5R6MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-128511.32 MB22页182
IC封装资料_电容_GJM0336C1E7R5BB01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1285110.43 MB296页202
IC封装资料_电容_GRM1885C1H6R0DA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12850944.07 KB30页7
IC封装资料_电源管理芯片_LTC3789EUFD_TRPBF.pdf
LTC378913789fcFormoreinformationwww.linear.com/LTC3789TypicalapplicaTionFeaTuresapplicaTionsDescripTionHighEfficiency,Synchronous,...
2024-12-12850611.07 KB30页94
IC封装资料_电感_SDFL1608LR56KTF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/11/15SunlordIndustrialPark,Dafuyu...
2024-12-12850457.75 KB7页2
IC封装资料_电源管理芯片_BQ24600RVAR.pdf
NVREFCEVFBTSVCCHIDRVNPHBTSTREGNLODRVGNDSRPSRNPACK+PACK-ADAPTER+ADAPTER-C4C7Q4SiR426Q5SiR426C6L13.3µH*D1BAT54C5C100.1µFC910µFVRE...
2024-12-128502.13 MB37页108
IC封装资料_三极管_WSD2068DN.pdf
SymbolParameterRatingUnitsVDSDrain-SourceVoltage20VVGSGate-SourceVoltage±12VID@TA=25℃ContinuousDrainCurrent,VGS@4.5V17.5AID@TA=7...
2024-12-12850958.83 KB6页182
IC封装资料_三极管_NTA4153NT1G.pdf
©SemiconductorComponentsIndustries,LLC,2014May,2019−Rev.71PublicationOrderNumber:NTA4153N/DNTA4153N,NTE4153N,NVA4153N,NVE4153NMO...
2024-12-12850212.1 KB6页288
IC封装资料_电容_TAJC226M016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12850210.32 KB7页70
IC封装资料_连接器_FPC0.5-40P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12850893.57 KB1页166
IC封装资料_电源管理芯片_OP284FSZ-REEL7.pdf
Rev.JInformationfurnishedbyAnalogDevicesisbelievedtobeaccurateandreliable.However,noresponsibilityisassumedbyAnalogDevicesforitsus...
2024-12-128501.06 MB24页81
IC封装资料_电源管理芯片_UC3844BD1R2G.pdf
©SemiconductorComponentsIndustries,LLC,2013August,2013−Rev.111PublicationOrderNumber:UC3844B/DUC3844B,UC3845B,UC2844B,UC2845BHig...
2024-12-12849482.14 KB19页35
IC封装资料_非易失性存储器_N25Q128A13BF840F.pdf
February2010Rev1.01/1851N25Q128128-Mbit,1.8V,multipleI/O,4-Kbytesubsectoreraseonbootsectors,XiPenabled,serialflashmemorywith108MHz...
2024-12-128495.82 MB185页226

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