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IC资料

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IC封装资料_电容_GJM1555C1H2R7BB01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1285610.43 MB296页102
IC封装资料_电容_CL10C250JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12856259.58 KB3页268
IC封装资料_三极管_SIA517DJ-T1-GE3.pdf
VishaySiliconixSiA517DJDocumentNumber:64832S13-0463-Rev.B,04-Mar-13www.vishay.com1Thisdocumentissubjecttochangewithoutnotice.THEPR...
2024-12-12856413.42 KB14页231
IC封装资料_连接器_1803413.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1285536.13 MB445页128
IC封装资料_电感_HK100515NJ-T.pdf
20REMINDERSNoticeforTAIYOYUDENproductsPleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.■ProductInformationinthisCatalogProduc...
2024-12-12855770.37 KB22页73
IC封装资料_电容_0402CG430J250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128541.05 MB27页271
IC封装资料_三极管_DMN2300UFB4-7B.pdf
DMN2300UFB4Documentnumber:DS35269Rev.5-21of7www.diodes.comJuly2019©DiodesIncorporatedDMN2300UFB420VN-CHANNELENHANCEMENTMODEMOSFET...
2024-12-12854532.44 KB7页297
IC封装资料_电容_1210F106M250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128541.05 MB27页199
IC封装资料_嵌入式微处理器_STC15W204S-35I-SOP16.pdf
STCMCULimitedSTC—8051单片机全球第一品牌，全球最大的8051单片机设计公司官方网站：www.STCMCU.comwww.GXWMCU.comSTC15F2K60S2系列单片机...
2024-12-1285319.39 MB1097页263
IC封装资料_电容_TAJE476M035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12853210.32 KB7页208
IC封装资料_电容_TAJD337M006RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12853208.62 KB7页219
IC封装资料_电容_GRM1885C1HR50CA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12853944.07 KB30页165
IC封装资料_电容_CL10A474KO8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A474KO8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-128531.42 MB36页85
IC封装资料_电感_SWPA6045S680MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-128531.32 MB22页127
IC封装资料_电感_NLV25T-R18J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV25-PF2520[1008inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV25-PFTypeNLV-PFSeries...
2024-12-12853215.06 KB9页242
IC封装资料_电感_NLV25T-330J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-12853318.58 KB6页18
IC封装资料_电容_GRM1555C1H6R2WA01D.pdf
GRM1555C1H6R2WA01_(0402,C0G:EIA,6.2pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12852944.44 KB30页158
IC封装资料_电容_B32774D4505K.pdf
FilmCapacitorsMetallizedPolypropyleneFilmCapacitors(MKP)Series/Type:B32774...B32778Date:June2018©EPCOSAG2018.Reproduction,publica...
2024-12-128521.46 MB48页102
IC封装资料_连接器_DF3A-5P-2DSA.pdf
May.1.2021Copyright2021HIROSEELECTRICCO.,LTD.AllRightsReserved.IncaseofconsiderationforusingAutomotiveequipment/devicewhichdemandh...
2024-12-12852222.32 KB1页59
IC封装资料_电容_CL10B472KC8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B472KC8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12852405.17 KB3页144

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