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IC资料

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IC封装资料_连接器_1803413.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1285736.13 MB445页128
IC封装资料_三极管_SIA517DJ-T1-GE3.pdf
VishaySiliconixSiA517DJDocumentNumber:64832S13-0463-Rev.B,04-Mar-13www.vishay.com1Thisdocumentissubjecttochangewithoutnotice.THEPR...
2024-12-12856413.42 KB14页231
IC封装资料_电容_TAJD337M006RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12856208.62 KB7页219
IC封装资料_电感_HK100515NJ-T.pdf
20REMINDERSNoticeforTAIYOYUDENproductsPleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.■ProductInformationinthisCatalogProduc...
2024-12-12856770.37 KB22页73
IC封装资料_电容_0201B222K160NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128551.05 MB27页300
IC封装资料_电容_TAJE476M035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12855210.32 KB7页208
IC封装资料_电感_SWPA6045S680MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-128551.32 MB22页127
IC封装资料_电容_0402CG430J250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128551.05 MB27页271
IC封装资料_电容_CL10A474KO8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A474KO8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-128541.42 MB36页85
IC封装资料_电源管理芯片_LTC3400BES6_TRPBF.pdf
LTC3400/LTC3400B13400faIPagersIMP3PlayersIDigitalCamerasILCDBiasSuppliesIHandheldInstrumentsIWirelessHandsetsIGPSReceiversIUpto92%...
2024-12-12854301.87 KB12页212
IC封装资料_电感_SWPA5040S5R6MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-128541.32 MB22页182
IC封装资料_电感_NLV25T-R18J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV25-PF2520[1008inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV25-PFTypeNLV-PFSeries...
2024-12-12854215.06 KB9页242
IC封装资料_电感_NLV25T-330J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-12854318.58 KB6页18
IC封装资料_电源管理芯片_BQ24600RVAR.pdf
NVREFCEVFBTSVCCHIDRVNPHBTSTREGNLODRVGNDSRPSRNPACK+PACK-ADAPTER+ADAPTER-C4C7Q4SiR426Q5SiR426C6L13.3µH*D1BAT54C5C100.1µFC910µFVRE...
2024-12-128542.13 MB37页108
IC封装资料_三极管_DMN2300UFB4-7B.pdf
DMN2300UFB4Documentnumber:DS35269Rev.5-21of7www.diodes.comJuly2019©DiodesIncorporatedDMN2300UFB420VN-CHANNELENHANCEMENTMODEMOSFET...
2024-12-12854532.44 KB7页297
IC封装资料_电容_1210F106M250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128541.05 MB27页199
IC封装资料_电容_CL10B472KC8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B472KC8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12854405.17 KB3页144
IC封装资料_电容_GRM188R61E224KA88D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12854944.07 KB30页70
IC封装资料_电容_GRM1885C1HR50CA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12854944.07 KB30页165
IC封装资料_电容_GRM1555C1H6R2WA01D.pdf
GRM1555C1H6R2WA01_(0402,C0G:EIA,6.2pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12853944.44 KB30页158

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