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IC资料

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IC封装资料_三极管_WSP4447.pdf
SymbolParameterRatingUnitsVDSDrain-SourceVoltage-40VVGSGate-SourceVoltage±20VID@TA=25℃ContinuousDrainCurrent,VGS@-10V1-11AID@TA=...
2024-12-127451.36 MB7页200
IC封装资料_电源管理芯片_TL431BCDBZRVL.pdf
ImportantnoticeDearCustomer,On7February2017theformerNXPStandardProductbusinessbecameanewcompanywiththetradenameNexperia.Nexperiais...
2024-12-12745278.43 KB28页70
IC封装资料_电容_CL10B223KB85PNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-12745452.9 KB21页158
IC封装资料_三极管_IRFS4310ZTRLPBF.pdf
4/23/12www.irf.com1HEXFET��PowerMOSFETBenefits�ImprovedGate,AvalancheandDynamicdV/dtRuggedness�FullyCharacterizedCapacitancean...
2024-12-12744413.07 KB11页18
IC封装资料_电容_GRM1555C1H1R2CA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12744920.26 KB29页167
IC封装资料_电容_CL10C4R3CB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12744259.57 KB3页205
IC封装资料_电容_GRM188R71H511KA01D.pdf
GRM188R71H511KA01_(0603,X7R:EIA,510pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12744962.49 KB30页72
IC封装资料_连接器_1844223.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMC1,5/3-G-3,5OrderNo.:1844223...
2024-12-12744246.58 KB5页157
IC封装资料_电源管理芯片_LTC3204EDC-5_TRMPBF.pdf
LTC3204-3.3/LTC3204-5/LTC3204B-3.3/LTC3204B-513204faFEATURESDESCRIPTIOUTYPICALAPPLICATIOUTheLTC®3204-3.3/LTC3204-5/LTC3204B-3.3/L...
2024-12-12744709.93 KB12页288
IC封装资料_电容_GRM155R61E225ME15D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1274310.43 MB296页8
IC封装资料_电容_CL10C471JB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12743316.29 KB3页249
IC封装资料_电容_CL10A106KQ8NNWC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12743259.57 KB3页260
IC封装资料_电容_0603B751K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127431.05 MB27页228
IC封装资料_电感_NLV32T-1R0J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-12743325.01 KB6页141
IC封装资料_三极管_SI2319CDS-T1-GE3.pdf
VishaySiliconixSi2319CDSDocumentNumber:66709S10-1286-Rev.A,31-May-10www.vishay.com1P-Channel40V(D-S)MOSFETFEATURES•Halogen-freeAc...
2024-12-12743320.69 KB10页151
IC封装资料_连接器_1803400.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1274336.13 MB445页87
IC封装资料_电容_TAJC157M004RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12742210.32 KB7页71
IC封装资料_连接器_1843240.pdf
https://www.phoenixcontact.com/us/produkte/184324021.12.2012Page1/5Basestrip-MCV1.5/4-GF-3.5-1843240Pleasebeinformedthatthedatasho...
2024-12-12742187.1 KB5页49
IC封装资料_电容_CC0201KRX7R9BB471.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12742998.46 KB11页173
IC封装资料_电容_CL10A106MPNNHBC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12742259.58 KB3页239

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