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IC资料

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IC封装资料_电容_CL10F473ZB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F473ZB8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-12622360.58 KB3页196
IC封装资料_电容_GCM1885C1H221JA16D.pdf
GCM1885C1H221JA16_(0603,C0G,220pF,50Vdc)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)4....
2024-12-12622841.48 KB28页288
IC封装资料_电容_TAJA334K050RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12622210.32 KB7页5
IC封装资料_电感_YPRH1204-3R3M.pdf
SMDPowerInductors-YPRH1204Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Hig...
2024-12-12622735.47 KB5页77
IC封装资料_电源管理芯片_TL431BMFDTVL.pdf
ImportantnoticeDearCustomer,On7February2017theformerNXPStandardProductbusinessbecameanewcompanywiththetradenameNexperia.Nexperiais...
2024-12-12622278.43 KB28页297
IC封装资料_电容_GRM188R71E104KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12622944.07 KB30页12
IC封装资料_电容_RVT1H100M0505-TR.pdf
RVTSeriesHUAHUIStandardproduct标准品Operatingwithwidetemperaturerange-40~+105C適用於-40~+105°C的寬溫範圍Loadlifeof2000hours負荷...
2024-12-126221.08 MB3页136
IC封装资料_电源管理芯片_NCP1252ADR2G.pdf
©SemiconductorComponentsIndustries,LLC,2016April,2019−Rev.81PublicationOrderNumber:NCP1252/DNCP1252CurrentModePWMControllerforFo...
2024-12-12622327.95 KB20页196
IC封装资料_电容_CC0603JRNPO9BN222.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-126211.22 MB13页95
IC封装资料_电容_CL10B152KB8SFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12621259.58 KB3页203
IC封装资料_电容_0805B473K101CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-126211.26 MB20页156
IC封装资料_电容_0805B152K101CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-126211.26 MB20页265
IC封装资料_电容_CL10A105KO8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12621259.58 KB3页44
IC封装资料_电源管理芯片_LTC3414IFE_TRPBF.pdf
LTC341413414fb■Point-of-LoadRegulation■NotebookComputers■PortableInstruments■DistributedPowerSystems■HighEfficiency:Upto95%■...
2024-12-12621356.81 KB16页250
IC封装资料_电容_CC1206JKNPOCBN470.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-126211.22 MB13页141
IC封装资料_电源管理芯片_MC7815CTG.pdf
©SemiconductorComponentsIndustries,LLC,2014November,2014−Rev.271PublicationOrderNumber:MC7800/DMC7800,MC7800A,MC7800AE,NCV78001....
2024-12-12620296.53 KB31页14
IC封装资料_电容_0805B222K251CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-126201.26 MB20页125
IC封装资料_电源管理芯片_LTC3872EDDB_TRMPBF.pdf
LTC387213872fcFormoreinformationwww.linear.com/LTC3872NoRSENSECurrentModeBoostDC/DCControllerHighEfficiency3.3VInput,5VOutputBoost...
2024-12-12620339.95 KB22页170
IC封装资料_电感_SDFL1608Q1R0KTF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/11/15SunlordIndustrialPark,Dafuyu...
2024-12-12620457.75 KB7页244
IC封装资料_电感_SWPA4030S330MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-126201.32 MB22页253

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