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IC资料

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IC封装资料_电感_YP0705-221M.pdf
SMDPowerInductors-YP0705Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121863721.48 KB5页113
IC封装资料_电容_CL10B224KO8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B224KO8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-121863361.58 KB3页39
IC封装资料_连接器_BM28B0.6-10DP2-0.35V_51_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121863562.52 KB8页8
IC封装资料_电容_CL10C151FB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121863306.67 KB3页25
IC封装资料_连接器_AFC01-S42H1A-00.pdf
更多资料下载请到五八文库wk.58sms.com深圳市钜硕电子有限公司AFC01-S**F**-00
2024-12-1218631.58 MB1页6
IC封装资料_电容_CL10B332KB8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B332KB8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-121863361.47 KB3页189
IC封装资料_电感_LQP15MN9N1B02D.pdf
SpecNo.JELF243C-0007P-01P.1/9MURATAMFG.CO.,LTD.ReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQP15MN□□□□02DReferenceSpecification1.Scope...
2024-12-121863245 KB9页227
IC封装资料_连接器_9631S-26Z02-GFN4.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121862204.61 KB1页236
IC封装资料_连接器_53398-0271.pdf
TABLE11番号NO.部品PART材質MATERIAL①ハウジングHOUSINGポリアミド(PA),UL94V-0,GLASS-FILLED,色:ナチュラル(ベージュ)POLYAMIDE(PA),UL94...
2024-12-121862855.65 KB4页257
IC封装资料_电容_CC0805KRX7RBBB682.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121862998.46 KB11页147
IC封装资料_电感_SDCL1005C27NJTDF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/05/15SunlordIndustrialPark,Dafuyu...
2024-12-121862376.19 KB4页87
IC封装资料_电容_CC1812KKX7RCBB222.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121862998.46 KB11页89
IC封装资料_信号隔离芯片_ADuM1300ARW.pdf
Triple-ChannelDigitalIsolatorsDataSheetADuM1300/ADuM1301Rev.KDocumentFeedbackInformationfurnishedbyAnalogDevicesisbelievedtobeaccu...
2024-12-121862698.36 KB32页60
IC封装资料_连接器_DF12E_3.5_-36DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121862288.67 KB11页153
IC封装资料_连接器_AFC01-S46FCA-00.pdf
CUSTOMER:CUSTOMERP/N:PARTNAME:PARTNO.:0.5mmPitchH=2.0mmSMT掀盖式DAET:2016.05.08DAET:2016.05.10DAET:2016.05.12李涛设计朱成峰审核朱...
2024-12-1218621.85 MB10页114
IC封装资料_电感_YSPI1040-4R7M.pdf
SMDPowerInductors-YSPI1040Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●M...
2024-12-121861702.46 KB5页20
IC封装资料_电感_NLV25T-1R0J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121860316.79 KB6页83
IC封装资料_三极管_AUIRF7484QTR.pdf
AUIRF7484QVDSS40VRDS(on)max.10mID14ADescriptionSpecificallydesignedforAutomotiveapplications,thisStripePlanardesignofHEXFET®P...
2024-12-121860500.94 KB11页139
IC封装资料_电容_R76UR32204030J.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comF3034_R76•9/19/20161Oneworld.OneKEMETB...
2024-12-1218602.62 MB25页261
IC封装资料_电容_GRM155R60J474KE19D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121860920.26 KB29页262

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