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IC资料

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IC封装资料_电容_CL10B272KB8SFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12557259.58 KB3页83
IC封装资料_连接器_1904969.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/6http://www.phoenixcontact.deFeb24,2011ExtractfromtheonlinecatalogZFKDS2,5-5,08OrderNo.:1904969...
2024-12-12557238.13 KB6页64
IC封装资料_三极管_IPB042N10N3G.pdf
1IPB042N10N3GRev.2.9,2017-07-17FinalDataSheetD²PAKDrainPin2,TabGatePin1SourcePin3MOSFETOptiMOSª3Power-Transistor,100VFeatures•N...
2024-12-125561020.59 KB10页98
IC封装资料_电容_CL10B684KO8VPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B684KO8VPNC●Product:Multi-layerCeramicCapacitorCAP,680㎋,16V,±10%,X7R,0603●AEC-Q200Quali...
2024-12-125565.81 MB36页5
IC封装资料_电感_YP1005-151M.pdf
SMDPowerInductors-YP1005Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-12556776.32 KB5页240
IC封装资料_电源管理芯片_SGM2019-3_3YC5GTR.pdf
SGM2019LowPower,LowDropout,RF-LinearRegulatorsGENERALDESCRIPTIONTheSGM2019serieslow-power,low-noise,low-dropout,CMOSlinearvoltager...
2024-12-12556468.67 KB16页14
IC封装资料_电容_GRM155R71H562KA88D.pdf
GRM155R71H562KA88_(0402,X7R:EIA,5600pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12556971.06 KB30页229
IC封装资料_电源管理芯片_AS78L05RTR-E1.pdf
AS78LXXDocumentnumber:DSxxxxxRev.3-11of17www.diodes.comAugust2013©DiodesIncorporatedAS78LXXDATASHEETAProductLineofDiodesIncorpora...
2024-12-12556491.77 KB17页258
IC封装资料_电感_LQP03TN0N8B02D.pdf
SpecNo.JELF243C-0015T-01P.1/12MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQP03TN□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-12556281.03 KB12页115
IC封装资料_电感_LQG18HN22NJ00D.pdf
SpecNo.JELF243B-0002V-01P.1/9MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQG18HN□□□□00DREFERENCESPECIFICATION1.ScopeT...
2024-12-12555271.3 KB9页20
IC封装资料_电容_CC0402BRNPO9BN1R5.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-125551.22 MB13页249
IC封装资料_电源管理芯片_LTC3576EUFE_TRPBF.pdf
LTC3576/LTC3576-113576fbTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTIONSwitchingPowerManagerwithUSBOn-the-Go+TripleStep-DownDC/D...
2024-12-12555671.37 KB48页73
IC封装资料_电感_NLV32T-120J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-12555325.74 KB6页196
IC封装资料_电容_GJM1555C1H3R9BB01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1255510.43 MB296页276
IC封装资料_电源管理芯片_LT1619EMS8_PBF.pdf
1LT16191619faLowVoltageCurrentModePWMController,LTCandLTareregisteredtrademarksofLinearTechnologyCorporation.TheLT®1619isafixedfr...
2024-12-12555345.31 KB20页258
IC封装资料_电感_YP0504-101M.pdf
SMDPowerInductors-YP0504Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-12555776.58 KB5页27
IC封装资料_三极管_NVD5117PLT4G-VF01.pdf
©SemiconductorComponentsIndustries,LLC,2017June,2019−Rev.21PublicationOrderNumber:NVD5117PL/DNVD5117PLMOSFET–Power,Single,P-Cha...
2024-12-12554213.28 KB6页256
IC封装资料_三极管_MMUN2111LT1G.pdf
©SemiconductorComponentsIndustries,LLC,2000July,2018−Rev.91PublicationOrderNumber:DTA114E/DMUN2111,MMUN2111L,MUN5111,DTA114EE,DT...
2024-12-12554187.24 KB12页191
IC封装资料_电容_GRM1555C1H2R1BA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12554920.26 KB29页58
IC封装资料_电容_GCJ21BR71C475KA01L.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-125544.17 MB96页131

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