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IC资料

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IC封装资料_三极管_MMUN2111LT1G.pdf
©SemiconductorComponentsIndustries,LLC,2000July,2018−Rev.91PublicationOrderNumber:DTA114E/DMUN2111,MMUN2111L,MUN5111,DTA114EE,DT...
2024-12-12554187.24 KB12页191
IC封装资料_电容_GRM1555C1H2R1BA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12554920.26 KB29页58
IC封装资料_连接器_1881574.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/4http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMCV0,5/4-G-2,5OrderNo.:188157...
2024-12-12554221.07 KB4页16
IC封装资料_电感_NLV25T-R27J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV25-PF2520[1008inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV25-PFTypeNLV-PFSeries...
2024-12-12553215.06 KB9页88
IC资料_HLS27DGW0570C (BANNER).pdf
DatasheetBanner'sHLS27HazardousLocationLEDStripLighthasasturdyaluminumhousingandisencasedinashatterproof,UV-stabilized,polycarbona...
2024-12-15553673.17 KB8页52
IC封装资料_连接器_1755532.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deFeb24,2010ExtractfromtheonlinecatalogMSTBVA2,5/4-GOrderNo.:1755532...
2024-12-12552230.01 KB5页42
IC封装资料_电容_GRM1885C1H430JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12552944.07 KB30页100
IC封装资料_电容_CL10A105KA8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12552259.58 KB3页172
IC封装资料_电感_MLG1005S15NJT000.pdf
INDUCTORSMay2016��MLG1005S1005[0402inch]**��JIS[EIA]��MLG1005S�MLG��更多资料下载请到五八文库wk....
2024-12-12552420.58 KB16页159
IC封装资料_电容_CL21B821KBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B821KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12551360.67 KB3页38
IC封装资料_电容_C0603NP0101JGTS.pdf
3Rev.201710MLCCMLCCMLCCMLCCCONTENT(MLCC)ESTANDARDNUMBER..............................................................................
2024-12-125511.92 MB48页85
IC封装资料_电容_GCM31MR71E225KA57L.pdf
IC封装资料_电容_GCM31MR71E225KA57L.pdf
2024-12-125513.63 MB1页256
IC封装资料_电感_LQW15AN3N9C00D.pdf
SpecNo.JELF243A-0050AA-01P.1/14MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQW15AN□□□□00DReferenceSpecification1.Scop...
2024-12-12551376.63 KB15页54
IC封装资料_电源管理芯片_TL432ASA-7.pdf
TL431/TL432ADJUSTABLEPRECISIONSHUNTREGULATORTL431*SO-8isafuturepackageDocumentnumber:DS35044Rev.6-21of14www.diodes.comApril2012©D...
2024-12-12551527.59 KB14页249
IC封装资料_连接器_DF12E_3.0_-80DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12551288.67 KB11页22
IC封装资料_连接器_1758092.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1255036.13 MB445页80
IC封装资料_电容_0603N3R9C500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-125501.26 MB20页249
IC封装资料_连接器_1731721.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/6http://www.phoenixcontact.deFeb24,2010ExtractfromtheonlinecatalogGMKDS3/2-7,62OrderNo.:1731721...
2024-12-12550224.35 KB6页267
IC封装资料_电容_GCM1885C1H330JA16D.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-125505.94 MB73页236
IC封装资料_电感_NLV25T-470J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-12550318.58 KB6页283

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