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IC资料

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IC封装资料_电容_CL31B225KCHSNNE.pdf
SPECIFICATION(Referencesheet)Supplier:Samsungelectro-mechanicsSamsungP/N:CL31B225KCHSNNEProduct:Multi-layerCeramicCapacitor...
2024-12-125381.43 MB36页91
IC封装资料_三极管_STP4NK60ZFP.pdf
Thisisinformationonaproductinfullproduction.January2014DocID025020Rev21/16STP4NK60Z,STP4NK60ZFPN-channel600V,1.7Ωtyp.,4AZener-pro...
2024-12-12537788.35 KB16页218
IC封装资料_三极管_IRF540NPBF.pdf
IRF540NPbFHEXFET®PowerMOSFET11/3/03ParameterTyp.Max.UnitsRθJCJunction-to-Case–––1.15RθCSCase-to-Sink,Flat,GreasedSurface0.50...
2024-12-12537241.78 KB9页236
IC封装资料_电容_CL10C1R8CC81PNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-12537452.9 KB21页178
IC封装资料_电容_GRM1555C1H9R0BA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12537920.26 KB29页124
IC封装资料_电容_GRM1555C1H470GA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12536920.26 KB29页75
IC封装资料_数据转换器_AD5628BCBZ-1-RL7.pdf
Octal,12-/14-/16-Bit,SPIVoltageOutputdenseDACwith5ppm/°C,On-ChipReferenceDataSheetAD5628/AD5648/AD5668Rev.JDocumentFeedbackInform...
2024-12-125361.04 MB30页238
IC封装资料_电容_CL10C100JB8NCNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12536340.14 KB3页33
IC封装资料_电容_1206X476M100NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-125361.05 MB27页148
IC封装资料_逻辑及时序器件_74LVC1G240DCKRE4.pdf
Seemechanicaldrawingsfordimensions.DBVPACKAGE(TOPVIEW)51VCCOE2A34GNDYDCKPACKAGE(TOPVIEW)2A34GNDVCC5OEY1YZPPACKAGE(BOTTOMVIEW)2AVCC...
2024-12-125362.2 MB29页154
IC封装资料_连接器_HTSS-105-01-L-DV-P-TR.pdf
(2.54mm).100"TSS,HTSS,ZSSSERIESZSS–113–03–L–D–0735HTSS–125–01–L–DVDuetotechnicalprogress,alldesigns,specificationsandcomp...
2024-12-12536713.21 KB2页134
IC封装资料_电容_1206CG180J102NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-125361.05 MB27页131
IC封装资料_连接器_AYF533035.pdf
–1–ACCTB1E201803-TDETAILEDFEATURESForFPC/FFCY5B/Y5BWFPC/FFCconnectors(0.5mmpitch)BacklockPitch0.5mm,lowprofile/spacesavinganddou...
2024-12-125361.1 MB13页30
IC封装资料_电容_LMK063BJ104KP-F.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12536653.27 KB26页112
IC封装资料_连接器_A0801AWR-11-F4MB1-R.pdf
A0801AWR-**-F4M*1-*HU2016.09.28QWY-GCCP-0705更多资料下载请到五八文库wk.58sms.com
2024-12-12536334.91 KB1页252
IC封装资料_电容_0402B332J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-125361.26 MB20页258
IC封装资料_电容_0201CG120J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-125351.05 MB27页263
IC封装资料_连接器_1830651.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1253536.13 MB445页189
IC封装资料_电容_CL03C3R3BA3GNNC.pdf
SPECIFICATIONSupplier:Samsungelectro-mechanicsSamsungP/N:Product:Multi-layerCeramicCapacitorDescription:CAP,3.3,25V,±0.1,C0G,0201...
2024-12-125351.55 MB36页221
IC封装资料_电感_SDCL1005C22NJTDF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/05/15SunlordIndustrialPark,Dafuyu...
2024-12-12535376.19 KB4页34

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