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IC资料

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IC封装资料_连接器_1830651.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1253536.13 MB445页189
IC封装资料_电容_GRM1555C1H470GA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12535920.26 KB29页75
IC封装资料_连接器_HTSS-105-01-L-DV-P-TR.pdf
(2.54mm).100"TSS,HTSS,ZSSSERIESZSS–113–03–L–D–0735HTSS–125–01–L–DVDuetotechnicalprogress,alldesigns,specificationsandcomp...
2024-12-12535713.21 KB2页134
IC封装资料_电容_1206CG180J102NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-125351.05 MB27页131
IC封装资料_连接器_AYF533035.pdf
–1–ACCTB1E201803-TDETAILEDFEATURESForFPC/FFCY5B/Y5BWFPC/FFCconnectors(0.5mmpitch)BacklockPitch0.5mm,lowprofile/spacesavinganddou...
2024-12-125351.1 MB13页30
IC封装资料_电容_0402B332J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-125351.26 MB20页258
IC封装资料_电容_0201CG120J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-125341.05 MB27页263
IC封装资料_电容_CL03C3R3BA3GNNC.pdf
SPECIFICATIONSupplier:Samsungelectro-mechanicsSamsungP/N:Product:Multi-layerCeramicCapacitorDescription:CAP,3.3,25V,±0.1,C0G,0201...
2024-12-125341.55 MB36页221
IC封装资料_电感_SDCL1005C22NJTDF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/05/15SunlordIndustrialPark,Dafuyu...
2024-12-12534376.19 KB4页34
IC封装资料_三极管_UMW_10N65F.pdf
650VUMW10N65●最大额定值（TC=25TC=25TC=25TC=25°°°°CCCC）●●●●AbsoluteAbsoluteAbsoluteAbsoluteMaximumMaximumMaximumMaximumRa...
2024-12-125343 MB9页51
IC封装资料_电容_LMK063BJ104KP-F.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12534653.27 KB26页112
IC封装资料_电容_T490A107M006ATE800.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-125331.54 MB23页274
IC封装资料_电容_CL10B224JP8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B224JP8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12533361.19 KB3页173
IC封装资料_电容_GRM1885C1H100GA01D.pdf
GRM1885C1H100GA01_(0603,C0G:EIA,10pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm...
2024-12-12533944.1 KB30页24
IC封装资料_电容_C0805C102K5RACTU.pdf
1©KEMETElectronicsCorporation•KEMETTower•OneEastBrowardBoulevardC1002_X7R_SMD•11/8/2018FortLauderdale,FL33301USA•954-766-2800...
2024-12-125331.48 MB25页272
IC封装资料_电容_0402N120K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-125331.26 MB20页220
IC封装资料_电容_GRM155R61E103KA01D.pdf
ChipMultilayerCeramicCapacitorsforGeneralPurposeGRM155R61E103KA01_(0402,X5R(EIA),10000pF,DC25V)_:PackagingCodeReferenceSheet■Scop...
2024-12-12532886.42 KB30页283
IC封装资料_电容_CL10C560JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12532259.58 KB3页258
IC封装资料_电源管理芯片_LTC3835EDHC-1_TRPBF.pdf
LTC3835-1138351fcTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTIONLowIQSynchronousStep-DownControllerL,LT,LTC,LTM,BurstMode,andOPT...
2024-12-12532376.96 KB28页296
IC封装资料_电源管理芯片_LT1374CR-SYNC_PBF.pdf
1LT13741374fd4.5A,500kHzStep-DownSwitchingRegulator■Constant500kHzSwitchingFrequency■HighPower16-PinTSSOPPackageAvailable■UsesA...
2024-12-12532786.96 KB32页20

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