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IC资料

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IC封装资料_三极管_UMW_10N65F.pdf
650VUMW10N65●最大额定值（TC=25TC=25TC=25TC=25°°°°CCCC）●●●●AbsoluteAbsoluteAbsoluteAbsoluteMaximumMaximumMaximumMaximumRa...
2024-12-125343 MB9页51
IC封装资料_连接器_HTSS-105-01-L-DV-P-TR.pdf
(2.54mm).100"TSS,HTSS,ZSSSERIESZSS–113–03–L–D–0735HTSS–125–01–L–DVDuetotechnicalprogress,alldesigns,specificationsandcomp...
2024-12-12534713.21 KB2页134
IC封装资料_电容_LMK063BJ104KP-F.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12534653.27 KB26页112
IC封装资料_电容_CL03C3R3BA3GNNC.pdf
SPECIFICATIONSupplier:Samsungelectro-mechanicsSamsungP/N:Product:Multi-layerCeramicCapacitorDescription:CAP,3.3,25V,±0.1,C0G,0201...
2024-12-125341.55 MB36页221
IC封装资料_电感_SDCL1005C22NJTDF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/05/15SunlordIndustrialPark,Dafuyu...
2024-12-12534376.19 KB4页34
IC封装资料_电容_0201CG120J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-125341.05 MB27页263
IC封装资料_电容_T490A107M006ATE800.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-125331.54 MB23页274
IC封装资料_电容_CL10B224JP8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B224JP8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12533361.19 KB3页173
IC封装资料_电容_GRM1885C1H100GA01D.pdf
GRM1885C1H100GA01_(0603,C0G:EIA,10pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm...
2024-12-12533944.1 KB30页24
IC封装资料_电容_C0805C102K5RACTU.pdf
1©KEMETElectronicsCorporation•KEMETTower•OneEastBrowardBoulevardC1002_X7R_SMD•11/8/2018FortLauderdale,FL33301USA•954-766-2800...
2024-12-125331.48 MB25页272
IC封装资料_电容_0402N120K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-125331.26 MB20页220
IC封装资料_电容_GRM155R61E103KA01D.pdf
ChipMultilayerCeramicCapacitorsforGeneralPurposeGRM155R61E103KA01_(0402,X5R(EIA),10000pF,DC25V)_:PackagingCodeReferenceSheet■Scop...
2024-12-12532886.42 KB30页283
IC封装资料_电容_CL10C560JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12532259.58 KB3页258
IC封装资料_电源管理芯片_LTC3835EDHC-1_TRPBF.pdf
LTC3835-1138351fcTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTIONLowIQSynchronousStep-DownControllerL,LT,LTC,LTM,BurstMode,andOPT...
2024-12-12532376.96 KB28页296
IC封装资料_电源管理芯片_LT1374CR-SYNC_PBF.pdf
1LT13741374fd4.5A,500kHzStep-DownSwitchingRegulator■Constant500kHzSwitchingFrequency■HighPower16-PinTSSOPPackageAvailable■UsesA...
2024-12-12532786.96 KB32页20
IC封装资料_三极管_SIR466DP-T1-GE3.pdf
VishaySiliconixSiR466DPNewProductDocumentNumber:68879S-82018-Rev.A,01-Sep-08www.vishay.com1N-Channel30-V(D-S)MOSFETFEATURES•Halog...
2024-12-12532430.44 KB13页228
IC封装资料_电容_C312G123J3SC000.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-125322.19 MB4页59
IC封装资料_电容_CL21C102JBCNNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-125321.45 MB36页13
IC封装资料_三极管_SPD04N80C3ATMA1.pdf
SPD04N80C3CoolMOSTMPowerTransistorFeatures•Newrevolutionaryhighvoltagetechnology•Extremedv/dtrated•Highpeakcurrentcapability•Q...
2024-12-12531479.54 KB10页101
IC封装资料_三极管_IXFN44N50.pdf
C1-184©2000IXYSAllrightsreservedSymbolTestConditionsMaximumRatingsIXFKIXFNVDSSTJ=25°Cto150°C500500VVDGRTJ=25°Cto150°C;RGS=1M...
2024-12-12531249.95 KB5页44

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