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IC资料

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IC封装资料_电感_SWPA4026S100MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-125251.32 MB22页236
IC封装资料_电源管理芯片_LT1618EDD_TRPBF.pdf
LT16181sn16181618fasAPPLICATIOSUFEATURESDESCRIPTIOUTYPICALAPPLICATIOUTheLT®1618step-upDC/DCconvertercombinesatradi-tionalvoltagef...
2024-12-12525293.68 KB16页293
AL-HG435A (A-BRIGHT).pdf
2006/10/11NOTES:1.Alldimensionsareinmillimeters(inches);2.Tolerancesare±0.1mm(0.004inch)unlessotherwisenoted.�SolderingironBasic...
2024-12-11524344.8 KB5页227
IC封装资料_电容_CL10C150JB8NCNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12524259.58 KB3页115
IC封装资料_电感_LQM21PL4R7MGCD.pdf
ProductSpecificationforApprovalIssuedDate:PartDescription:ChipCoil(ChipInductors)CustomerPartNo.:MURATAPartNo.:LQM21PL4R7MGCDAckno...
2024-12-12524261.65 KB10页173
IC封装资料_电容_CC0603KRX7R6BB334.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-125231.22 MB13页24
IC封装资料_电感_MLF1608A1R8JTD25.pdf
February2017INDUCTORSFebruary2017MultilayerFerriteMLF16081608[0603inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsMLF1608...
2024-12-12523311.11 KB11页182
IC封装资料_电容_CL10C471JB81PNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12523259.58 KB3页180
IC封装资料_电容_CGA2B1X7R1C104M050BC.pdf
SPECIFICATIONSPEC.No.A-General-fDATE:2017Aug.ToUpontheacceptanceofthisspec.previousspec.(C2005-1420)shallbeabolished.CUSTOMER’SPR...
2024-12-12523541.59 KB34页154
IC封装资料_电容_CL05A474KA5NNN.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL05A474KA5NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12523374.34 KB4页155
IC封装资料_电容_CC1206KKX7R9BB224.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-125231.22 MB13页205
IC封装资料_电感_NLV25T-560J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-12523316.79 KB6页167
IC封装资料_电容_GCG219R91H223KA03D.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-125235.94 MB73页91
IC封装资料_电容_CL10B561KC8WPNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-12523452.9 KB21页92
IC封装资料_电容_GRM188R71C473KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12523944.07 KB30页260
IC封装资料_电容_1206B682K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-125231.05 MB27页178
IC封装资料_电容_TAJC225M035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12522210.32 KB7页285
IC封装资料_电容_TAJB685K020RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12522210.32 KB7页72
IC封装资料_电容_GRM188R71H331KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12522944.07 KB30页126
IC封装资料_电容_GRM188R71C334KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12522944.07 KB30页128

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