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IC封装资料_电容_GCM21BR71C225KA64L.pdf
Lsize2.0±0.15mmWsize1.25±0.15mmTsize1.25±0.15mmExternalterminalwidthe0.2to0.7mmDistancebetweenexternalterminalsg0.7mmmin.Sizeco...
2024-12-124513.22 MB2页8
IC封装资料_电容_GCJ21AR72E102KXJ1D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-124514.17 MB96页297
IC封装资料_电容_GRM188R71A334KA61D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12451944.07 KB30页139
IC封装资料_连接器_1757381.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1245136.13 MB445页185
IC封装资料_电感_NLCV25T-3R3M-EFR.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-12451249.79 KB16页278
IC封装资料_电源管理芯片_LT1963AEQ-1.8_TRPBF.pdf
LT1963ASeries11963affFormoreinformationwww.linear.com/LT1963ATypicalapplicaTionDescripTion1.5A,LowNoise,FastTransientResponseLDORe...
2024-12-12451629.18 KB28页73
IC封装资料_电容_CL10A105KP8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12450259.58 KB3页74
IC封装资料_电容_0603F333M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-124501.05 MB27页270
IC封装资料_电容_0603B102J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-124501.26 MB20页288
IC封装资料_三极管_TDM3458.pdf
July15,2015TechcodeSemiconductorLimitedwww.techcodesemi.com1Techcode®N-ChannelEnhancementModeMOSFETTDM3458DATASHEETDESCRIPTIONThe...
2024-12-12450472.06 KB8页159
IC封装资料_电容_GRM188R61A106KE69J.pdf
GRM188R61A106KE69_(0603,X5R:EIA,10uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm...
2024-12-12450939.27 KB30页270
IC封装资料_电容_GRM1885C2A750JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12450944.07 KB30页29
IC封装资料_电容_0805N330J501CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-124501.26 MB20页269
IC封装资料_电感_YNR8040-6R8M.pdf
SMDPowerInductors-YNR8040Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12449666.38 KB5页254
IC封装资料_电容_0805B471K101CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-124491.26 MB20页13
IC封装资料_电源管理芯片_XL7046.pdf
XLSEMIDatasheet1.0A100KHz90V降压型DC-DC转换器XL7046Rev1.1www.xlsemi.com1特点�8V至80V工作电压范围�最大占空比85%�最小压差2.0V�输...
2024-12-12449420.52 KB12页158
IC封装资料_电感_NLV32T-330J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV32-PF3225[1210inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV32-PFTypeNLV-PFSeries...
2024-12-12448224.35 KB10页63
IC封装资料_电感_MLZ1608A2R2WT000.pdf
May2017INDUCTORSMultilayerFerriteMLZ16081608[0603inch]**DimensionsCodeJIS[EIA]InductorsforDecouplingCircuitsMLZ1608TypeMLZSeries更...
2024-12-12448335.39 KB10页266
IC封装资料_三极管_SIHG20N50C-E3.pdf
SiHG20N50Cwww.vishay.comVishaySiliconixS17-1726-Rev.D,20-Nov-171DocumentNumber:91382Fortechnicalquestions,contact:hvm@vishay.comTH...
2024-12-12448283.33 KB8页103
IC封装资料_电容_TAJE158K004RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12448210.32 KB7页112

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