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IC资料

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IC封装资料_电容_CC0805KRX7R0BB472.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-124451.22 MB13页291
IC封装资料_电容_0402B103K250CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-124451.26 MB20页227
IC封装资料_电感_LQP03TN1N0B02D.pdf
SpecNo.JELF243C-0015T-01P.1/12MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQP03TN□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-12445281.03 KB12页30
IC封装资料_电容_JMK316ABJ476ML-T.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12445857.12 KB55页192
IC封装资料_电容_CL10F104ZA8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F104ZA8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-12444360.47 KB3页179
IC封装资料_电容_0805B361K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-124441.05 MB27页289
IC封装资料_电容_CC0805KRX7R9BB333.pdf
ProductSpecification–June16,2017V.18DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSGeneralPurpose&HighCapacitanceClass2,X7R6.3V...
2024-12-124441.61 MB20页69
IC封装资料_连接器_1753673.pdf
PHOENIXCONTACTInc.,USAPage1/5http://www.phoenixcon.comJan31,2011ExtractfromtheonlinecatalogMSTBV2,5/14-GOrderNo.:1753673Thefigures...
2024-12-12444232.31 KB5页11
IC封装资料_连接器_53261-0371.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12444549.58 KB5页299
IC封装资料_电容_0402X104K6R3CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-124431.26 MB20页116
IC封装资料_连接器_F0502-B-06-20T.pdf
FPC0.50mmConnectorsF0502-B-XX-20T≥24D更多资料下载请到五八文库wk.58sms.com
2024-12-12443290.85 KB1页224
IC封装资料_电感_YPRH105R-101M.pdf
SMDPowerInductors-YPRH105RSeries深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●U...
2024-12-12443765.25 KB5页203
IC封装资料_连接器_AFC11-S34ICA-00.pdf
浙江博众电气有限公司ZHEJIANGBOZHONGELECTRICCO.，LTD承认书SPECIFICATIONFORAPPROVAL客户Customer：产品名Project：规格型号PartNo：贵公...
2024-12-124431.4 MB10页269
IC封装资料_电容_GRM1555C1H271JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12443920.26 KB29页213
IC封装资料_电感_MLK1005SR12JT000.pdf
INDUCTORSFebruary2015MultilayerCeramicMLK10051005[0402inch]**DimensionsCodeJIS[EIA]InductorsforHighFrequencyCircuitsMLK1005TypeMLK...
2024-12-12443209.31 KB10页164
IC封装资料_电感_NLV25T-1R5J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-12443316.79 KB6页272
IC封装资料_电容_CL10C471JE8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12442316.34 KB3页269
IC封装资料_电容_GRM1555C1H8R2DA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12442920.26 KB29页298
IC封装资料_电源管理芯片_LT1009CZ_PBF.pdf
LT1009Series11009ffTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTION2.5VReferenceTheLT®1009isaprecisiontrimmed2.5Vshuntregula-tor...
2024-12-12442200.6 KB8页282
IC封装资料_电容_CL10C220JB8NCNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12442316.3 KB3页57

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