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IC资料

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IC封装资料_电容_DE1E3KX222MN4AN01F.pdf
LeadTypeDiscCeramicCapacitors(SafetyStandardCertified)ResinMoldingSMDTypeCeramicCapacitors(SafetyStandardCertified)C85E.pdfSep.14,...
2024-12-124431.8 MB73页168
IC封装资料_三极管_TDM3205.pdf
July15,2015TechcodeSemiconductorLimitedwww.techcodesemi.com1Techcode®P-ChannelEnhancementModeMOSFETTDM3205DATASHEETDESCRIPTIONThe...
2024-12-12442472.96 KB7页250
IC封装资料_电容_C322J104J90C000.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-124424.24 MB7页35
IC封装资料_电容_TAJD156M035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12442210.32 KB7页157
IC封装资料_连接器_1759127.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1244236.13 MB445页259
IC封装资料_电容_GRM188C71E225KE11D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12442944.07 KB30页160
IC封装资料_电容_GRM1555C1H8R2DA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12442920.26 KB29页298
IC封装资料_连接器_1755859.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1244236.13 MB445页182
IC封装资料_电容_GRM155R60J824KE19D.pdf
GRM155R60J824KE19_(0402,X5R:EIA,0.82uF,DC6.3V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit...
2024-12-12441924.51 KB29页200
IC封装资料_电容_GRM21BR61E475KA12L.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1244110.43 MB296页290
IC封装资料_电容_CC1206JRNPO9BN121.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-124411.22 MB13页287
IC封装资料_三极管_PDTC143ZT_215.pdf
1.Productprofile1.1GeneraldescriptionNPNResistor-EquippedTransistor(RET)familyinSurface-MountedDevice(SMD)plasticpackages.1.2Featu...
2024-12-124411.57 MB17页240
IC封装资料_电容_TAJA334M035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12441210.32 KB7页124
IC封装资料_电源管理芯片_TL494N.pdf
TL494Pulse-Width-ModulationControlCircuitsTL49412016APRhttp://www.hgsemi.com.cn更多资料下载请到五八文库wk.58sms.comTL49422016APRht...
2024-12-124411.85 MB4页109
IC封装资料_连接器_A2541HWV-21P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-12441814.91 KB16页241
IC封装资料_电容_TAJA105K020RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12440210.32 KB7页202
IC封装资料_连接器_DF12C_3.0_-30DS-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12440288.67 KB11页263
IC封装资料_电容_GRM1885C1H6R2BA01D.pdf
GRM1885C1H6R2BA01_(0603,C0G:EIA,6.2pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12440944.1 KB30页123
IC封装资料_电感_YNR3010-3R3M.pdf
SMDPowerInductors-YNR3010Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12440661.07 KB5页268
IC封装资料_电容_CL10B103KO8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12440259.58 KB3页105

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