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IC资料

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IC封装资料_电容_CL21C100DBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-123721.45 MB36页210
IC封装资料_电源管理芯片_HX7136 _SOT23-3.pdf
HX71XX系列Ver2.00(1/9)系列LDO线性稳压器■产品简介系列是采用CMOS工艺制造，低功耗的高压稳压器，最高输入电压可达18V，输出电压范围为2V...
2024-12-12372565.81 KB9页75
IC封装资料_电感_SWPA5040S8R2MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-123721.32 MB22页260
IC封装资料_电容_CL03C090DA3GNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-123717.46 MB84页81
IC封装资料_电容_CC0805KRX7RBBB331.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-123711.22 MB13页167
IC封装资料_三极管_SI3456DDV-T1-GE3.pdf
VishaySiliconixSi3456DDVNewProductDocumentNumber:69075S09-1399-Rev.B,20-Jul-09www.vishay.com1N-Channel30-V(D-S)MOSFETFEATURES•Hal...
2024-12-12371288.5 KB11页206
IC封装资料_三极管_SI2309CDS-T1-GE3.pdf
VishaySiliconixSi2309CDSNewProductDocumentNumber:68980S-82584-Rev.A,27-Oct-08www.vishay.com1P-Channel60-V(D-S)MOSFETFEATURES•Halo...
2024-12-12371297.91 KB9页251
IC封装资料_连接器_M55-6016842R.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12370318.48 KB3页96
IC封装资料_连接器_1806229.pdf
https://www.phoenixcontact.com/us/produkte/180622919.10.2012Page1/6Basestrip-GMSTB2,5/2-GF-7,62-1806229Pleasebeinformedthatthedata...
2024-12-12370186.49 KB6页177
IC封装资料_电容_CC1206KRX7RYBB103.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12370998.46 KB11页143
IC封装资料_电容_GCM1885C1H102JA16D.pdf
Lsize1.6±0.1mmWsize0.8±0.1mmTsize0.8±0.1mmExternalterminalwidthe0.2to0.5mmDistancebetweenexternalterminalsg0.5mmmin.Sizecodeini...
2024-12-123703.23 MB2页15
IC封装资料_电容_0603CG161J201NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-123691.05 MB27页73
IC封装资料_电容_0603CG3R3C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-123691.05 MB27页267
IC封装资料_电感_NLCV25T-100K-PF.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-12369249.79 KB16页27
IC封装资料_电感_NLV32T-082J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-12369325.01 KB6页10
IC封装资料_电感_NLV25T-039J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-12369318.58 KB6页113
IC封装资料_电容_CL10C271JB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12369316.29 KB3页281
IC封装资料_三极管_MUN5214DW1T1G.pdf
©SemiconductorComponentsIndustries,LLC,2014April,2018−Rev.41PublicationOrderNumber:DTC114YD/DMUN5214DW1,NSBC114YDXV6,NSBC114YDP6...
2024-12-12369180.79 KB9页40
IC封装资料_连接器_1803468.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1236936.13 MB445页223
IC封装资料_电感_YPRH1204-471M.pdf
SMDPowerInductors-YPRH1204Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Hig...
2024-12-12369735.47 KB5页138

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