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IC资料

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IC封装资料_电容_GRM1885C2A390JA01D.pdf
GRM1885C2A390JA01_(0603,C0G:EIA,39pF,DC100V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12366944 KB30页226
IC封装资料_电容_GRM155R71H681KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12366920.26 KB29页167
IC封装资料_电容_0805B472K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-123661.26 MB20页110
IC封装资料_连接器_1755820.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1236636.13 MB445页90
IC封装资料_电容_0603B104K250CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-123651.26 MB20页98
IC封装资料_电容_CC0603JRNPO9BN130.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-123651.22 MB13页136
IC封装资料_传感器_NBPDANN150PGUNV.pdf
BasicBoardMountPressureSensors:NBPSeries–Uncompensated/Unamplified60mbarto10bar[1psito150psi]DESCRIPTIONHoneywell’sBasicBoardMou...
2024-12-12364578.8 KB9页124
IC封装资料_电容_CL10C470GB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12364316.18 KB3页166
IC封装资料_连接器_1733648.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/6http://www.phoenixcontact.deFeb24,2010ExtractfromtheonlinecatalogSMKDSP1,5/9-5,08OrderNo.:1733...
2024-12-12364230.04 KB6页22
AL-HUB33 (A-BRIGHT).pdf
2007/3/14NOTES:1.Alldimensionsareinmillimeters(inches);2.Tolerancesare±0.1mm(0.004inch)unlessotherwisenoted.�SolderingironBasics...
2024-12-11364340.71 KB5页3
IC封装资料_电容_TMK316AB7475KL-T.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1236410.43 MB296页90
IC封装资料_电容_TAJA154K050RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12364210.32 KB7页39
IC封装资料_电容_GRM188R71A224KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12364944.07 KB30页220
IC封装资料_三极管_BSS308PEH6327XTSA1.pdf
BSS308PEOptiMOS™P3Small-Signal-TransistorFeatures•P-channel•Enhancementmode•Logiclevel(4.5Vrated)•ESDprotected•Qualifiedacco...
2024-12-12363330.41 KB9页104
IC封装资料_电容_TAJB105K035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12363210.32 KB7页51
IC封装资料_电容_0402CG100F500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-123631.05 MB27页144
IC封装资料_电容_0402CG6R0C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-123631.05 MB27页43
IC封装资料_电感_SLF6028T-101MR42-PF.pdf
INDUCTORSApril2016WoundFerriteSLF6028InductorsforPowerCircuitsSLF6028TypeSLFSeries更多资料下载请到五八文库wk.58sms.com(2/9)INDUCTO...
2024-12-12362229.58 KB9页183
IC封装资料_电感_SWPA4020S120MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-123621.32 MB22页238
IC封装资料_电源管理芯片_LT3008ETS8-3.3_TRPBF.pdf
LT3008Series13008fcTEMPERATURE(°C)DROPOUTVOLTAGE(mV)QUIESCENTCURRENT(μA)4003008TA01b2001005005003002501505350231064504–50–2502...
2024-12-12362320.57 KB20页217

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