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IC资料

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IC封装资料_电容_CL10C3R9CC81PNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-12365452.9 KB21页139
IC封装资料_电容_GRM1885C2A390JA01D.pdf
GRM1885C2A390JA01_(0603,C0G:EIA,39pF,DC100V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12365944 KB30页226
IC封装资料_电容_TC212A226K016Y.pdf
SunlordIndustrialPark,DafuyuanIndustrialZone,Guanlan,Shenzhen,China518110Tel:0086-755-29832660Fax:0086-755-82269029E-Mail:sunlord@...
2024-12-12364350.17 KB10页278
IC封装资料_电容_CL10C090DB81PNC.pdf
●Supplier:Samsungelectro-mechanicsCL10C090DB81PNC●Product:Multi-layerCeramicCapacitorCAP,9㎊,50V,±0.5㎊,C0G,0603●AEC-Q200Quali...
2024-12-123645.85 MB36页110
IC封装资料_连接器_KF120-2.54-2P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12364686.3 KB1页258
IC封装资料_电容_GRM155R71H681KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12364920.26 KB29页167
IC封装资料_电容_0603B104K250CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-123641.26 MB20页98
IC封装资料_电容_CL10C470GB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12363316.18 KB3页166
IC封装资料_电源管理芯片_LTC1682IMS8-3.3_TRPBF.pdf
1LTC1682/LTC1682-3.3/LTC1682-5DoublerChargePumpswithLowNoiseLinearRegulatorILowOutputNoise:60µVRMS(100kHzBW)IAdjustableorFixedBoo...
2024-12-12363279.87 KB12页281
IC封装资料_连接器_1733648.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/6http://www.phoenixcontact.deFeb24,2010ExtractfromtheonlinecatalogSMKDSP1,5/9-5,08OrderNo.:1733...
2024-12-12363230.04 KB6页22
IC封装资料_电源管理芯片_LT3014IDD_TRPBF.pdf
LT301413014fdTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTION20mA,3Vto80VLowDropoutMicropowerLinearRegulatorTheLT®3014isahighvol...
2024-12-12363266.84 KB16页237
IC封装资料_电容_0402CG6R0C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-123631.05 MB27页43
IC封装资料_电容_CC0603JRNPO9BN130.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-123631.22 MB13页136
IC封装资料_传感器_NBPDANN150PGUNV.pdf
BasicBoardMountPressureSensors:NBPSeries–Uncompensated/Unamplified60mbarto10bar[1psito150psi]DESCRIPTIONHoneywell’sBasicBoardMou...
2024-12-12363578.8 KB9页124
IC封装资料_电容_UCD1V101MNL1GS.pdf
132UUUUA247jCD(φ4toφ8×6.2)(φ12.5toφ18)(φ8×10,φ10)0.3MAX.φD±0.5B±0.2A±0.2A±0.2C±0.20.5MAX.EHH0.3MAX.φD±0.5B±0.2A±...
2024-12-12363817.62 KB2页63
AL-HUB33 (A-BRIGHT).pdf
2007/3/14NOTES:1.Alldimensionsareinmillimeters(inches);2.Tolerancesare±0.1mm(0.004inch)unlessotherwisenoted.�SolderingironBasics...
2024-12-11363340.71 KB5页3
IC封装资料_电容_GRM188R71A224KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12363944.07 KB30页220
IC封装资料_三极管_BSS308PEH6327XTSA1.pdf
BSS308PEOptiMOS™P3Small-Signal-TransistorFeatures•P-channel•Enhancementmode•Logiclevel(4.5Vrated)•ESDprotected•Qualifiedacco...
2024-12-12362330.41 KB9页104
IC封装资料_三极管_2N7002DW.pdf
JIANGSUCHANGJIANGELECTRONICSTECHNOLOGYCO.,LTDSOT-363Plastic-EncapsulateMOSFETswww.cj-elec.com1I,Sep,20162N7002DWDualN-channelMOSFE...
2024-12-123621.49 MB5页291
IC封装资料_电容_TMK316AB7475KL-T.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1236210.43 MB296页90

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