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IC封装资料_电容_C1608X5R1E475KT000E.pdf
MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[0201inch]C1005[0402inch]C1608[0603inch]C2012[0...
2024-12-123581.61 MB56页116
IC封装资料_电源管理芯片_LT3080EMS8E_PBF.pdf
LT308013080fcAdjustable1.1ASingleResistorLowDropoutRegulatorTheLT®3080isa1.1Alowdropoutlinearregulatorthatcanbeparalleledtoincrea...
2024-12-12358459.19 KB28页130
IC封装资料_电容_CC0603KRX7R9BB393.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-123581.22 MB13页231
IC封装资料_电容_UCD1C100MCL1GS.pdf
132UUUUA247jCD(φ4toφ8×6.2)(φ12.5toφ18)(φ8×10,φ10)0.3MAX.φD±0.5B±0.2A±0.2A±0.2C±0.20.5MAX.EHH0.3MAX.φD±0.5B±0.2A±...
2024-12-12358817.62 KB2页150
IC封装资料_连接器_1766165.pdf
PHOENIXCONTACTInc.,USAPage1/5http://www.phoenixcon.comJan25,2011ExtractfromtheonlinecatalogGMSTB2,5/6-G-7,62OrderNo.:1766165Thefig...
2024-12-12358230.38 KB5页250
IC封装资料_连接器_AFC11-S18ICA-00.pdf
浙江博众电气有限公司ZHEJIANGBOZHONGELECTRICCO.，LTD承认书SPECIFICATIONFORAPPROVAL客户Customer：产品名Project：规格型号PartNo：贵公...
2024-12-123581.4 MB10页43
IC封装资料_连接器_1843619.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/4http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMCV1,5/3-G-3,5OrderNo.:184361...
2024-12-12358227 KB4页235
IC封装资料_电源管理芯片_RT9013-18GB.pdf
RT90131DS9013-10April2011www.richtek.comPinConfigurationsApplications�CDMA/GSMCellularHandsets�PortableInformationAppliances�La...
2024-12-12357384.76 KB13页241
IC封装资料_电容_GRM1885C2A101FA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12357944.07 KB30页182
IC封装资料_电容_CC0402GRNPO8BN150.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12357998.46 KB11页117
IC封装资料_电容_CL10B153KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12357259.58 KB3页153
IC封装资料_电容_293D476X9010B2TE3.pdf
293Dwww.vishay.comVishaySpragueRevision:07-Feb-20191DocumentNumber:40002Fortechnicalquestions,contact:tantalum@vishay.comTHISDOCUM...
2024-12-12357568.22 KB24页201
IC封装资料_电源管理芯片_ADR421BRZ-REEL7.pdf
ADI中文版数据手册是英文版数据手册的译文，敬请谅解翻译中可能存在的语言组织或翻译错误，ADI不对翻译中存在的差异或由此产生的错误负责。...
2024-12-12356716.44 KB24页81
IC封装资料_三极管_IRF9310TRPBF.pdf
www.irf.com1IRF9310PbFHEXFET��PowerMOSFETNotes��through�areonpage2FeaturesandBenefitsApplications•��...
2024-12-12356366.6 KB8页232
IC封装资料_连接器_AFC11-S43ICA-00.pdf
浙江博众电气有限公司ZHEJIANGBOZHONGELECTRICCO.，LTD承认书SPECIFICATIONFORAPPROVAL客户Customer：产品名Project：规格型号PartNo：贵公...
2024-12-123561.4 MB10页127
IC封装资料_电感_MLG1005SR12JT000.pdf
INDUCTORSMay2016��MLG1005S1005[0402inch]**��JIS[EIA]��MLG1005S�MLG��更多资料下载请到五八文库wk....
2024-12-12356420.58 KB16页15
IC封装资料_电容_CL10A225KO8N3NC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A225KO8N3NC·Product:Multi-layerCeramicCapacitor...
2024-12-123551.45 MB36页261
IC封装资料_电容_CC0805JRNPO0BN200.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12355998.46 KB11页127
IC封装资料_电源管理芯片_AL8861Y-13.pdf
AL8861Documentnumber:DS39435Rev.3-21of18www.diodes.comOctober2017©DiodesIncorporatedAL8861NEWPRODUCT40V1.5ABUCKLEDDRIVERDescripti...
2024-12-123551.1 MB18页295
IC封装资料_电容_GRM1555C1H7R5WA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12355920.26 KB29页13

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