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IC封装资料_电感_YPRH104R-4R7M.pdf
SMDPowerInductors-YPRH104RSeries深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●U...
2024-12-12349762.21 KB4页58
IC封装资料_电容_C312G473J4SC000.pdf
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2024-12-123482.19 MB4页272
IC封装资料_电源管理芯片_TLV1117-33IDCYR.pdf
TLV1117-ADJOUTPUTADJ/GNDINPUTProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&CommunityTLV1117SLVS561L–DECEMBER2004...
2024-12-123481.68 MB40页53
IC封装资料_电容_CL10B473KB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B473KB8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-12348361.37 KB3页25
IC封装资料_电容_LMK105BBJ475MVLF.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12348653.27 KB26页202
IC封装资料_电容_CL10A105KL8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12348259.57 KB3页240
IC封装资料_电源管理芯片_LT8611IUDD_TRPBF.pdf
LT861118611faFormoreinformationwww.linear.com/LT8611TYPICALAPPLICATIONFEATURESDESCRIPTION42V,2.5ASynchronousStep-DownRegulatorwith...
2024-12-12348419.94 KB26页186
IC封装资料_电容_GRM1555C1HR40WA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12347920.26 KB29页30
IC封装资料_电容_GRM1555C1H471GA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12347920.26 KB29页274
IC封装资料_连接器_1803507.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1234736.13 MB445页58
IC封装资料_电源管理芯片_AMS1117-3_3.pdf
AdvancedMonolithicSystems,Inc.www.advanced-monolithic.comPhone(925)443-0722Fax(925)443-0723AdvancedAMS1117Monolithic1ALOWDROPOUTVO...
2024-12-12347183.21 KB8页106
IC封装资料_电容_CL10C181JB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-123471.42 MB36页103
IC封装资料_电容_TAJB475K016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12347210.32 KB7页244
IC封装资料_电容_TAJB106M025RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12347210.32 KB7页110
IC封装资料_连接器_KF2EDGCVM-X-7.62-4P.pdf
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2024-12-12347634.58 KB1页129
IC封装资料_连接器_DF12D_4.0_-50DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12347288.67 KB11页247
IC封装资料_电容_CL10B272KB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B272KB8NFNC·Product:Multi-layerCeramicCapacitor...
2024-12-123461.45 MB36页236
IC封装资料_电容_GRM1885C1H151GA01D.pdf
GRM1885C1H151GA01_(0603,C0G:EIA,150pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12346944.1 KB30页121
IC封装资料_电容_0805CG620J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-123461.05 MB27页284
IC封装资料_电容_CC1206JKNPOCBN180.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12346998.46 KB11页75

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