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IC资料

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IC封装资料_电感_MLF1608A2R2KTA00.pdf
February2017INDUCTORSFebruary2017MultilayerFerriteMLF16081608[0603inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsMLF1608...
2024-12-12340311.11 KB11页150
IC封装资料_电感_LQG15HN39NJ02D.pdf
SpecNo.JELF243B-0009T-01P.1/11MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQG15HN□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-12340273.56 KB11页220
IC封装资料_电容_GCM1555C1H2R5CA16D.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-123403.36 MB73页264
IC封装资料_电容_0603B104J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-123401.05 MB27页36
IC封装资料_电容_0805CG100F101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-123391.05 MB27页175
IC封装资料_连接器_1.25T-4A.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12339273.91 KB1页119
IC封装资料_电容_CL10C391JB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-123391.39 MB36页72
IC封装资料_电源管理芯片_XC61CN3302MR-G.pdf
1/16XC61CSeriesLowVoltageDetectors(VDF=0.8V～1.5V)StandardVoltageDetectors(VDF1.6V～6.0V)■GENERALDESCRIPTIONTheXC61Cseriesarehigh...
2024-12-12339690.95 KB16页123
IC封装资料_电源管理芯片_TPS62085RLTR.pdf
50607080901000.0010.0100.1001.000Efficiency(%)Iout(A)Vin=2.5VVin=3.3VVin=4.2VVin=5.0VC004Vout=1.8VTPS620872.5Vto6VVINPOWERGOODVOSF...
2024-12-123391.12 MB25页62
IC封装资料_电源管理芯片_TPS54620RGYR.pdf
PHPVINGNDBOOTVSENSECOMPTPS54620ENRT/CLKSS/TRExposedThermalPadCssRrtR3C1CbootCoLoR1R2CinC2VINVINVOUTPWRGDCopyright©2016,TexasInstr...
2024-12-123392.2 MB47页202
IC封装资料_电容_CL10C8R2DB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12339259.57 KB3页148
IC封装资料_电容_GRM188R71H273KA61D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12339944.07 KB30页117
IC封装资料_电容_GRM1885C2A130JA01D.pdf
GRM1885C2A130JA01_(0603,C0G:EIA,13pF,DC100V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12339943.97 KB30页32
IC封装资料_连接器_F0502-B-38-20T.pdf
FPC0.50mmConnectorsF0502-B-XX-20T≥24D更多资料下载请到五八文库wk.58sms.com
2024-12-12338290.85 KB1页156
IC封装资料_电容_CL31A476MPHNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31A476MPHNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-123381.48 MB36页291
IC封装资料_三极管_TMC1320-LA.pdf
POWERMOSFETsFORSTEPPERMOTORSINTEGRATEDCIRCUITSTRINAMICMotionControlGmbH&Co.KGHamburg,GermanyTMC1320-LADATASHEETTMC262WITH4XTMC1320...
2024-12-123371.68 MB12页1
IC封装资料_连接器_KF127-5.08-12P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12337505.5 KB1页199
IC封装资料_连接器_BM28B0.6-20DP2-0.35V_51_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-12337562.52 KB8页287
IC封装资料_电容_CC1206ZKY5V7BB106.pdf
SProductSpecification–March07,2017V.8DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSGeneralpurpose&HighcapacitanceClass2,Y5V6.3...
2024-12-123371.08 MB13页270
IC封装资料_电容_0201B392K250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-123371.05 MB27页115

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