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IC资料

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IC封装资料_电容_CL10C2R5BB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121815259.58 KB3页158
IC封装资料_电容_0805F105Z160CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1218141.26 MB20页59
IC封装资料_三极管_TDM3484.pdf
August17,2016TechcodeSemiconductorLimitedwww.techcodesemi.com1Techcode®DualN-ChannelEnhancementModeMOSFETTDM3484DATASHEETDESCRIPT...
2024-12-121814837.48 KB8页230
IC封装资料_电容_GRM1555C1H3R6WA01D.pdf
GRM1555C1H3R6WA01_(0402,C0G:EIA,3.6pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121814944.43 KB30页270
IC封装资料_电源管理芯片_LP2951CDR2G.pdf
©SemiconductorComponentsIndustries,LLC,1995August,2018−Rev.311PublicationOrderNumber:LP2950/DLP2950,LP2951,NCV2951100mA,LowPower...
2024-12-121814272.36 KB22页10
IC封装资料_电感_SWPA6020S150MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1218141.32 MB22页73
IC封装资料_电容_CL21A475KOFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21A475KOFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1218131.42 MB36页40
IC封装资料_电源管理芯片_LTC3862EGN-1_TRPBF.pdf
LTC3862-1138621faFormoreinformationwww.linear.com/LTC3862-1TypicalapplicaTionFeaTuresapplicaTionsDescripTionMulti-PhaseCurrentMode...
2024-12-1218131.63 MB42页284
IC封装资料_电容_TAJB336K016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121813210.32 KB7页199
IC封装资料_电容_GRM0335C1H6R8BA01.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12181310.43 MB296页206
IC封装资料_电容_GRM1555C1H1R3BA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121813920.26 KB29页41
IC封装资料_电容_CL10C101KB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121813340.37 KB3页4
IC封装资料_电源管理芯片_F2410S-1W.pdf
YUANDC-DCCONVERTERF系列FxxxxS-xW3KVDC隔离0.1W～2W非稳压单输出SIP7脚封装输入电压3.3V/5V/9V/12V/15V/24VDC输出电压3.3V/5V/9V/12V/15V/...
2024-12-121813489.36 KB4页77
IC封装资料_电容_CC0603CRNPO9BN2R0.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1218121.22 MB13页6
IC封装资料_电容_0402CG3R9C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1218121.05 MB27页264
IC封装资料_连接器_1.25T-5A.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121812273.91 KB1页94
IC封装资料_电感_YSPI0730-6R8M.pdf
SMDPowerInductors-YSPI0730Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Mol...
2024-12-121812702.26 KB5页11
IC封装资料_电感_YPRH104R-331M.pdf
SMDPowerInductors-YPRH104RSeries深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●U...
2024-12-121812762.21 KB4页258
IC封装资料_电容_CL10C220JB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-1218111.39 MB36页227
IC封装资料_电容_JDK063BJ105MP-FD.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-121811653.27 KB26页21

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