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IC资料

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IC封装资料_连接器_DF12E_5.0_-36DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121810288.67 KB11页262
IC封装资料_电感_YNR8040-150M.pdf
SMDPowerInductors-YNR8040Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121810666.38 KB5页187
IC封装资料_连接器_A2541HWV-26P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-121810814.83 KB16页149
IC封装资料_电容_CL10B392KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121810259.58 KB3页232
IC封装资料_电源管理芯片_LM2595T-5.0.pdf
SIMPLESWITCHER®PowerConverter150kHz1AStep-DownVoltageRegulatorGeneralDescriptionTheLM2595seriesofregulatorsaremonolithicintegrate...
2024-12-1218104.47 MB23页93
IC封装资料_电容_0603B102K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1218101.26 MB20页145
IC封装资料_电容_CC1210KKX7RYBB224.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1218101.22 MB13页92
IC封装资料_电容_GJM0335C1E1R5WB01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12180910.43 MB296页65
IC封装资料_电容_GRM1885C1E102JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121809944.07 KB30页289
IC封装资料_连接器_2-1734592-8.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121809247.85 KB3页133
IC封装资料_电源管理芯片_BQ21040DBVR.pdf
Copyright©2016,TexasInstrumentsIncorporatedSystemLoadbq21040GNDCHGVOUTBATRISETVINISETTSVINNTCTEMPPACK+PACK±RCHG1µF1µF+±Produc...
2024-12-1218094 MB32页262
IC封装资料_电感_YNR8040-470M.pdf
SMDPowerInductors-YNR8040Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121809666.38 KB5页293
IC封装资料_电容_AC0603JRNPO9BN470.pdf
85ProductSpecification–July5,2018V.11DATASHEETSURFACEMOUNTMULTILAYERCERAMICCAPACITORSAutomotivegradeNP0/X7R6.3VTO630V0.2pFto2.2µ...
2024-12-1218091.06 MB24页23
IC封装资料_电容_CL10B182KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121808259.57 KB3页250
IC封装资料_电容_FC0H224ZFTBR24.pdf
1©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comS6011_FC•3/29/2017Oneworld.OneKEMETBe...
2024-12-121808867.01 KB16页70
IC封装资料_连接器_1751280.pdf
PHOENIXCONTACTInc.,USAPage1/5http://www.phoenixcon.comJan19,2011ExtractfromtheonlinecatalogMKDS1/6-3,5OrderNo.:1751280Thefiguresho...
2024-12-121808225.36 KB5页276
IC封装资料_接口及驱动芯片_TXB0104RUTR.pdf
ProcessorPeripheralVCCAVCCBProductFolderOrderNowTechnicalDocumentsTools&SoftwareSupport&CommunityAnIMPORTANTNOTICEattheendofthisda...
2024-12-1218081.45 MB41页12
IC封装资料_电容_0402X105K100NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1218081.05 MB27页216
IC封装资料_电容_CL10B562KB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B562KB8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-121807361.46 KB3页292
IC封装资料_电容_0805N101G500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1218071.26 MB20页115

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