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IC资料

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IC封装资料_电容_CL10C7R5DB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121764316.21 KB3页151
IC封装资料_电容_12065G105ZAT2A.pdf
29GeneralSpecifications101316PARTNUMBER(SEEPAGE4FORCOMPLETEPARTNUMBEREXPLANATION)08053GZA2AT104Size(L”xW”)DielectricY5V=GCapacit...
2024-12-121764492.09 KB3页76
IC封装资料_连接器_AFC01-S11FCA-00.pdf
CUSTOMER:CUSTOMERP/N:PARTNAME:PARTNO.:0.5mmPitchH=2.0mmSMT掀盖式DAET:2016.05.08DAET:2016.05.10DAET:2016.05.12李涛设计朱成峰审核朱...
2024-12-1217641.85 MB10页204
IC封装资料_电感_YSPI1050-3R3M.pdf
SMDPowerInductors-YSPI1050Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●M...
2024-12-121764700.51 KB5页174
IC封装资料_电容_CC0603CRNPO9BN1R5.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1217631.22 MB13页43
IC封装资料_电容_0402N5R6D500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1217631.26 MB20页31
IC封装资料_电容_0402N150J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1217631.26 MB20页201
IC封装资料_电容_GRM1555C1H101FA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121763920.26 KB29页293
IC封装资料_电容_GRM1555C1H200GA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121763920.26 KB29页29
IC封装资料_三极管_IRFL014NTRPBF.pdf
06/07/04IRFL014NPbF��www.irf.com1HEXFET®PowerMOSFETSDGVDSS=55VRDS(on)=0.16ΩID=1.9AFifthGenerationHEXFET®MOSFETs...
2024-12-121763247.06 KB8页157
IC封装资料_电容_1206B473K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1217631.05 MB27页40
IC封装资料_连接器_DF3A-13P-2DSA.pdf
May.1.2021Copyright2021HIROSEELECTRICCO.,LTD.AllRightsReserved.IncaseofconsiderationforusingAutomotiveequipment/devicewhichdemandh...
2024-12-121763222.32 KB1页176
IC封装资料_电容_TAJC336M016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121762210.32 KB7页135
IC封装资料_三极管_NTR1P02T1G.pdf
©SemiconductorComponentsIndustries,LLC,2002June,2019−Rev.81PublicationOrderNumber:NTR1P02T1/DNTR1P02,NVR1P02MOSFET–Power,P-Chan...
2024-12-121762200.97 KB5页274
IC封装资料_电容_EMVE160ADA101MF55G.pdf
SURFACEMOUNTALUMINUMELECTROLYTICCAPACITORSDownsized,105CCAT.No.E1001E@Ratedvoltagerange:6.3to450V,capacitancerange:0.47to6800MF@En...
2024-12-121762146.92 KB2页216
IC封装资料_电容_GRM155R61A334KE15D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121762920.26 KB29页173
IC封装资料_连接器_1751277.pdf
PHOENIXCONTACTInc.,USAPage1/5http://www.phoenixcon.comJan19,2011ExtractfromtheonlinecatalogMKDS1/5-3,5OrderNo.:1751277Thefiguresho...
2024-12-121761248.96 KB5页26
IC封装资料_电感_LQW18AN18NJ00D.pdf
SpecNo.JELF243A-0024Y-01P.1/11MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQW18AN□□□□00DREFERENCESPECIFICATION1.Scope...
2024-12-121761361.69 KB12页90
IC封装资料_电容_293D226X06R3A2TE3.pdf
293Dwww.vishay.comVishaySpragueRevision:27-Jun-20191DocumentNumber:40002Fortechnicalquestions,contact:tantalum@vishay.comTHISDOCUM...
2024-12-121761565.24 KB24页185
AB-33Y6-12VD-T10 (A-BRIGHT).pdf
AAA---BBBRRRIIIGGGHHHTTTA-BRIGHTINDUSTRIALCO.,LTD.A-BRIGHT10/30/20061MULTILAMPSLEDBULBDataSheetFeature:HighefficiencyLEDmaterialsa...
2024-12-111761192.07 KB3页122

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