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IC封装资料_电容_CC0603JRNPO9BN430.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1217571.22 MB13页86
IC封装资料_电感_LQG15HN3N9S02D.pdf
SpecNo.JELF243B-0009T-01P.1/11MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQG15HN□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-121757273.56 KB11页85
IC封装资料_连接器_1755794.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12175736.13 MB445页184
IC封装资料_电容_0805CG3R9C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1217571.05 MB27页114
IC封装资料_三极管_MJD122T4G.pdf
©SemiconductorComponentsIndustries,LLC,2013September,2016−Rev.151PublicationOrderNumber:MJD122/DMJD122,NJVMJD122(NPN),MJD127,NJV...
2024-12-121757184.95 KB8页115
IC封装资料_连接器_AFC11-S35ICA-00.pdf
浙江博众电气有限公司ZHEJIANGBOZHONGELECTRICCO.，LTD承认书SPECIFICATIONFORAPPROVAL客户Customer：产品名Project：规格型号PartNo：贵公...
2024-12-1217571.4 MB10页47
IC封装资料_电容_GRM1555C1H2R5BA01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12175710.43 MB296页228
IC封装资料_电容_LMK212ABJ106KG-T.pdf
注意■本产品目录所记载的内容为2016年10月之内容。因改良等原因，可能会不经预告而变更记载内容，所以请务必在使用前先确认最新的产品信息...
2024-12-1217561.83 MB52页176
IC封装资料_电容_CL10B392KB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B392KB8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-121756361.65 KB3页273
IC封装资料_连接器_SM04B-GHP-A-TB.pdf
GHCONNECTORGHCONNECTORGHCONNECTORGHCONNECTOR1.25mmpitch/DisconnectableCrimpstyleconnectorsEmbossTapeGHCONNECTORGHCONNECTORGHCONNEC...
2024-12-121756661.06 KB4页218
IC封装资料_连接器_DF12E_3.5_-30DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121756288.67 KB11页204
IC封装资料_电源管理芯片_MCP73811T-420I_OT.pdf
©2007MicrochipTechnologyInc.DS22036B-page1MCP73811/2Features•CompleteLinearChargeManagementController-IntegratedPassTransistor-I...
2024-12-121756747.73 KB22页284
IC封装资料_电感_NLV32T-271J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121756325.74 KB6页135
IC封装资料_电容_CC1206KKX7R0BB105.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1217561.22 MB13页21
IC封装资料_电容_GRM1885C1H1R2BA01D.pdf
GRM1885C1H1R2BA01_(0603,C0G:EIA,1.2pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121756944.12 KB30页190
IC封装资料_电容_CC0201CRNPO9BN6R8.pdf
ProductSpecification–March7,2017V.16DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSGeneralpurposeClass1,NP016VTO50V0.22pFto100n...
2024-12-1217551.34 MB14页169
IC封装资料_电源管理芯片_LTC1871EMS_TRPBF.pdf
LTC187111871feTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTIONWideInputRange,NoRSENSE™CurrentModeBoost,FlybackandSEPICController...
2024-12-121755602.47 KB36页122
IC封装资料_电感_LQW15AN33NG00D.pdf
SpecNo.JELF243A-0050AA-01P.1/14MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQW15AN□□□□00DReferenceSpecification1.Scop...
2024-12-121755376.63 KB15页297
IC封装资料_电感_MLZ2012P220WT000.pdf
May2017INDUCTORS积层铁氧体MLZ20122012[0805inch]**表示尺寸代码。JIS[EIA]去耦电路用电感器MLZ2012型MLZ系列更多资料下载请到五八文库wk....
2024-12-121754483.14 KB15页256
IC封装资料_电阻_FMF25FPJR025-LHL.pdf
SPECIFICATIONFORAPPROVALDATE:CUSTOMER:PARTNAME:MetalStripTypeHalogenFreeCurrentSensingResistorsCUSTOMER'SDWG.NO.CUSTOMER'SPARTNO.P...
2024-12-121754367.83 KB10页192

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