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IC资料

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IC封装资料_连接器_1829183.pdf
https://www.phoenixcontact.com/us/products/182918310/28/2014Page1/5Basestrip-GMSTBV2,5/5-GF-7,62-1829183Pleasebeinformedthatthedat...
2024-12-121737177.77 KB5页255
IC封装资料_电感_SWPA4030S101MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1217371.32 MB22页9
IC封装资料_电感_SWPA4018S220MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1217371.32 MB22页209
IC封装资料_连接器_1753712.pdf
https://www.phoenixcontact.com/us/produkte/175371219.10.2012Page1/7Basestrip-MSTBV2,5/16-G-1753712Pleasebeinformedthatthedatashown...
2024-12-121737203.32 KB7页43
IC封装资料_电容_CL10C2R7CB81PNC.pdf
●Supplier:Samsungelectro-mechanicsCL10C2R7CB81PNC●Product:Multi-layerCeramicCapacitorCAP,2.7㎊,50V,±0.25㎊,C0G,0603●AEC-Q200Qu...
2024-12-1217375.8 MB36页213
AL-HG636D (A-BRIGHT).pdf
2006/10/11NOTES:1.Alldimensionsareinmillimeters(inches);2.Tolerancesare±0.1mm(0.004inch)unlessotherwisenoted.�SolderingironBasic...
2024-12-111737339.97 KB5页31
IC封装资料_三极管_2N7002BKVL.pdf
1.Productprofile1.1GeneraldescriptionN-channelenhancementmodeField-EffectTransistor(FET)inasmallSOT23(TO-236AB)Surface-MountedDevi...
2024-12-121737812.71 KB17页121
IC封装资料_电容_AC0603KRX7R9BB102.pdf
85ProductSpecification–July5,2018V.11DATASHEETSURFACEMOUNTMULTILAYERCERAMICCAPACITORSAutomotivegradeNP0/X7R6.3VTO630V0.2pFto2.2µ...
2024-12-1217371.06 MB24页74
IC封装资料_电感_YP0705-2R2M.pdf
SMDPowerInductors-YP0705Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121736721.48 KB5页78
IC封装资料_电容_0603F224M250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1217361.05 MB27页229
IC封装资料_电容_0603B102K250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1217361.05 MB27页14
IC封装资料_电容_GRM1555C1H820JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121736920.26 KB29页276
IC封装资料_电源管理芯片_LTC3872ETS8_TRPBF.pdf
LTC387213872fcFormoreinformationwww.linear.com/LTC3872NoRSENSECurrentModeBoostDC/DCControllerHighEfficiency3.3VInput,5VOutputBoost...
2024-12-121736339.95 KB22页169
IC封装资料_电容_GRM155R61A824KE15D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121736920.26 KB29页78
IC封装资料_连接器_1729128.pdf
©PHOENIXCONTACT2017PCBterminalblock,Wavesoldering,ScrewconnectionwithtensionsleeveOrderNo.:1729128Type:MKDSN1,5/2-5,08Datasheet1M...
2024-12-121736299.42 KB13页252
IC封装资料_电容_0402B152K160NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1217361.05 MB27页242
IC封装资料_连接器_1881477.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMC0,5/5-G-2,5OrderNo.:1881477...
2024-12-121735251.25 KB5页36
IC封装资料_电容_GRM1555C1H1R5CA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121735920.26 KB29页108
IC封装资料_微控制器_FT60F011A-RB.pdf
FremontMicroDevicesFT60F01xRev1.19第1页2019-1-22特性全自我知识产权8位指令集8层10bit硬件堆栈1Kx14b程序FLASH存储空间（16bytes/...
2024-12-1217351.58 MB62页44
IC封装资料_电容_TAJV336K035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121735210.32 KB7页155

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