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IC封装资料_电感_MLF1608A4R7JT000.pdf
February2017INDUCTORSFebruary2017MultilayerFerriteMLF16081608[0603inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsMLF1608...
2024-12-121732311.11 KB11页119
IC封装资料_电容_TAJA226M006RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121732210.32 KB7页180
IC封装资料_电容_TAJD227K006RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121732210.32 KB7页177
IC封装资料_电容_CL10B472KB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B472KB8NFNC·Product:Multi-layerCeramicCapacitor...
2024-12-1217321.45 MB36页282
IC封装资料_电感_NLCV25T-3R3M-EFD.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-121732249.79 KB16页294
IC封装资料_电容_0603CG180F500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1217321.05 MB27页98
IC封装资料_电容_CL10A475KO8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121732259.58 KB3页79
IC封装资料_电容_0603B331K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1217311.05 MB27页91
IC封装资料_电感_SWPA5012S4R7NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1217311.32 MB22页103
IC封装资料_连接器_KF124-3.5-5P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121731203.82 KB1页27
IC封装资料_电容_1210F226M250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1217301.05 MB27页152
IC封装资料_电容_GRM155R71E562KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121730920.26 KB29页89
IC封装资料_电容_CL10B224KA8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B224KA8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-1217301.45 MB36页136
IC封装资料_电源管理芯片_AP2127K-ADJTRG1.pdf
AP2127Documentnumber:DS36478Rev.7-21of24www.diodes.comDecember2017©DiodesIncorporatedAP2127300mAHIGHSPEED,EXTREMELYLOWNOISECMOSLD...
2024-12-1217301010.23 KB24页67
IC封装资料_电感_NLV25T-680J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121730316.79 KB6页289
IC封装资料_电源管理芯片_LTC3703IGN-5_TRPBF.pdf
LTC3703-5137035faAPPLICATIOSUDESCRIPTIOUFEATURESTYPICALAPPLICATIOU■HighVoltageOperation:Upto60V■Large1ΩGateDrivers(with5VSupply...
2024-12-121730460.71 KB32页140
IC封装资料_电容_0805B123K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1217301.05 MB27页110
IC封装资料_电感_NLV25T-012J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121730318.57 KB6页114
IC封装资料_电容_CL10C471KB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121730316.52 KB3页98
IC封装资料_电感_NLV32T-047J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121729325.74 KB6页268

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