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IC资料

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IC封装资料_电容_GRM1555C1H390JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121183920.26 KB29页269
IC封装资料_电感_WPN3012H2R2MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-121979624.92 KB9页236
IC封装资料_电容_GRM1555C1H390GA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12308920.26 KB29页205
IC封装资料_电感_VLS252012T-2R2M1R3.pdf
(1/2)002-02/20080822/e531_vls252012.fm•Allspecificationsaresubjecttochangewithoutnotice.SMDInductors(Coils)ForPowerLine(Wound,Mag...
2024-12-121750130.34 KB2页90
IC封装资料_电容_CL10CR47BB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12528259.58 KB3页76
IC封装资料_电源管理芯片_LTC4412IS6_TRPBF.pdf
LTC441214412fbFormoreinformationwww.linear.com/LTC4412TypicalapplicaTionDescripTionLowLossPowerPath™ControllerinThinSOTTheLTC®44...
2024-12-121649486.18 KB14页138
IC封装资料_电容_CL10C910JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-1273259.58 KB3页207
IC封装资料_电容_C2012X5R1C106KT0J0E.pdf
COM-GEN-006DELIVERYSPECIFICATIONSPEC.No.C-General-fDATE:Aug,2019ToUpontheacceptanceofthisspec.previousspec.(C2011-0454)shallbeabol...
2024-12-1211561.79 MB37页277
IC封装资料_电源管理芯片_LTC4412HVIS6_TRPBF.pdf
1LTC4412HVsn4412hv4412hvfsAPPLICATIOSUFEATURESDESCRIPTIOUTYPICALAPPLICATIOU36V,LowLossPowerPathTMControllerinThinSOTIVeryLowLossRe...
2024-12-12131260.58 KB12页199
IC封装资料_机械式继电器_G6K-2P.pdf
1G6KG6KSurfaceMountingRelaySurfaceMountingRelaywiththeWorld’sSmallestMountingArea•Subminiaturemodelassmallas5.2(H)×6.5(W)×10(L...
2024-12-1215391.72 MB9页77
IC封装资料_电容_GRM155R61C225ME44D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12567920.26 KB29页233
IC封装资料_电容_GRM1555C1H391JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12198920.26 KB29页74
IC封装资料_电容_CL10B103KA8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-1214505.82 MB36页206
IC封装资料_电容_CL10CR75BB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121001259.58 KB3页280
IC封装资料_电容_CL10CR68BB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121470322 KB2页90
IC封装资料_电容_CL10CR56BB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121226259.58 KB3页188
IC封装资料_电容_0805B682K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127461.05 MB27页77
IC封装资料_电容_C2012X5R1E106K125AB.pdf
February2019MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[020...
2024-12-128701.65 MB57页119
IC封装资料_电感_WPN3012H3R3MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-12575624.92 KB9页292
IC封装资料_机械式继电器_G6KU-2F-Y.pdf
1G6KG6KSurfaceMountingRelaySurfaceMountingRelaywiththeWorld’sSmallestMountingArea•Subminiaturemodelassmallas5.2(H)×6.5(W)×10(L...
2024-12-128181.72 MB9页279

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