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IC封装资料_电容_0805B223K251NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128621.05 MB27页278
IC封装资料_电源管理芯片_LTC3400BES6_TRPBF.pdf
LTC3400/LTC3400B13400faIPagersIMP3PlayersIDigitalCamerasILCDBiasSuppliesIHandheldInstrumentsIWirelessHandsetsIGPSReceiversIUpto92%...
2024-12-12852301.87 KB12页212
IC封装资料_电源管理芯片_LTC3388IDD-3_PBF.pdf
LTC3388-1/LTC3388-31338813faFormoreinformationwww.linear.com/LTC3388TYPICALAPPLICATIONFEATURESDESCRIPTION20VHighEfficiencyNanopowe...
2024-12-121074452.27 KB22页296
IC封装资料_电感_SWPA6045S3R3MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1213211.32 MB22页213
IC封装资料_电容_CL03C1R5BB3GNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-127847.46 MB84页102
IC封装资料_电容_GRM155R60J105ME19D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121505920.26 KB29页263
IC封装资料_电容_CL10A225KP8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A225KP8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-129371.42 MB36页235
IC封装资料_电容_0603N471J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1218061.26 MB20页278
IC封装资料_电容_0603N471J101CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-128481.26 MB20页59
IC封装资料_电容_0805B223K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-125681.26 MB20页43
IC封装资料_电感_SWPA4018S101MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-122611.32 MB22页114
IC封装资料_电感_SWPA6045S4R7MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1214791.32 MB22页205
IC封装资料_电源管理芯片_LTC3401EMS_TRPBF.pdf
1LTC34013401fbTYPICALAPPLICATIONUAPPLICATIOSUDESCRIPTIOUFEATURES1A,3MHzMicropowerSynchronousBoostConverterTheLTC®3401isahigheffic...
2024-12-121971318.69 KB16页209
IC封装资料_电容_GRM21BR71C105KA01L.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1285910.43 MB296页122
IC封装资料_电源管理芯片_LTC3895IFE_PBF.pdf
LTC389513895faFormoreinformationwww.linear.com/LTC3895TypicalapplicaTionFeaTuresDescripTion150VLowIQ,SynchronousStep-DownDC/DCCont...
2024-12-1214352.24 MB38页286
IC封装资料_电容_GRM155R60J106ME44D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121254920.26 KB29页131
IC封装资料_电容_0603N510J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-12611.26 MB20页148
IC封装资料_电容_CL10A225KQ8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12112259.58 KB3页232
IC封装资料_电感_SWPA4018S150MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1219151.32 MB22页274
IC封装资料_电容_CL10A225KQ5LNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A225KQ5LNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1213531.45 MB36页48

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