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IC资料

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IC封装资料_电容_CL10C470JB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-1215911.39 MB36页80
IC封装资料_电容_GRM155R61A104KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-1254920.26 KB29页163
IC封装资料_电容_CL10C470JB8NCNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121599259.58 KB3页273
IC封装资料_电容_CL10C470GB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12364316.18 KB3页166
IC封装资料_电容_0805B393K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1218371.26 MB20页150
IC封装资料_电容_C0805C471K5RACTU.pdf
1©KEMETElectronicsCorporation•KEMETTower•OneEastBrowardBoulevardC1002_X7R_SMD•11/8/2018FortLauderdale,FL33301USA•954-766-2800...
2024-12-124691.48 MB25页257
IC封装资料_电阻_CN24JTN470.pdf
ThickFilmChipResistorArraysThickFilmChipResistorNetworks(CNSeriesStandard)Halogen-FreeDocumentNo.TCN-XX0S001SReviseDate2016/06/27p...
2024-12-12230548.18 KB12页265
IC封装资料_电感_SWPA8040S220MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1211521.32 MB22页101
IC封装资料_电阻_B72520T0300K062.pdf
CTVS�CeramictransientvoltagesuppressorsSMDmultilayervaristors(MLVs),standardseriesSeries/Type:Date:May2017©EPCOSAG2017.Reproduct...
2024-12-1214631.64 MB79页166
IC封装资料_电源管理芯片_LTC4100EG_TRPBF.pdf
LTC410014100fcFormoreinformationwww.linear.com/LTC4100TypicalapplicaTionDescripTionSmartBatteryChargerControllerTheLTC®4100SmartB...
2024-12-121061401.92 KB30页128
IC封装资料_电容_GRM1555C1H120JZ01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12166810.43 MB296页270
IC封装资料_电容_GRM155R61A105KE01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121480920.26 KB29页268
IC封装资料_电容_CL10A475KP9NHBC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121720259.58 KB3页257
IC封装资料_电容_CL10C470JB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12781316.29 KB3页142
IC封装资料_电容_CL10A475KP8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A475KP8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-1214761.42 MB36页278
IC封装资料_电容_CL10C470JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121625259.58 KB3页283
IC封装资料_电容_C822E104J60C000.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-1210692.9 MB5页139
IC封装资料_电容_0805B431K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-126711.05 MB27页125
IC封装资料_电容_0805B393K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1217331.05 MB27页249
IC封装资料_电阻_CR1210FR050P05R.pdf
CR-SeriesThickFilmChipResistorProductSpecificationsDocumentNo.S-10-12-01-04ReleasedDate2019/03/12PageNo.1/12■■TThhiicckkFFiillmm...
2024-12-1216691.14 MB12页49

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