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IC封装资料_电源管理芯片_LTC4278IDKD_TRPBF.pdf
LTC427814278fc••••12mΩ1µF30.9Ω24k1.8k38.3k100k12k0.1µF33pF0.1µF2.2nF1µFtONSYNCPGDLYUVLOPWRGDSENSE–VCMPSENSE+RCMPVNEGRCL...
2024-12-121505586.8 KB42页168
IC封装资料_电源管理芯片_LTC4274AIUHF-1_PBF.pdf
LTC4274A/LTC4274C14274acfeFormoreinformationwww.linear.com/LTC4274AnLTPoE++PSESwitches/RoutersnLTPoE++PSEMidspansnIEEE802.3atType1...
2024-12-12901414.29 KB30页158
IC封装资料_电容_GRM155R61A473KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121317920.26 KB29页293
IC封装资料_电容_CL10B102KB8NFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121051259.58 KB3页86
IC封装资料_电容_CL10B102KB8NCNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12146259.58 KB3页200
IC封装资料_电容_0805B473K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-12531.05 MB27页74
IC封装资料_电感_SWPA252012S1R0NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-121621.32 MB22页50
IC封装资料_电源管理芯片_LTC4290BIUJ_PBF.pdf
LTC4290/LTC42711429071fbFormoreinformationwww.linear.com/LTC4290nPoEPSESwitches/RoutersnPoEPSEMidspansAPPLICATIONSFEATURESDESCRIPT...
2024-12-121044489.19 KB32页272
IC封装资料_二极管_BAT60BE6327.pdf
2007-04-191BAT60B...SiliconSchottkyDiode•HighcurrentrectifierSchottkydiodewithverylowVFdrop(typ.0.24VatIF=10mA)•Forpowersupplyap...
2024-12-121292153.84 KB6页229
IC封装资料_二极管_1PS79SB31.pdf
ImportantnoticeDearCustomer,On7February2017theformerNXPStandardProductbusinessbecameanewcompanywiththetradenameNexperia.Nexperiais...
2024-12-121717344.79 KB8页231
IC封装资料_电容_GRM155R61A474KE15D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121067920.26 KB29页54
IC封装资料_电容_GRM1555C1H200GA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121762920.26 KB29页29
IC封装资料_电容_CL10B102KB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B102KB8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-12210361.47 KB3页237
IC封装资料_电容_GRM1555C1H181JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121884920.26 KB29页32
IC封装资料_电容_CL10B102KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121352259.57 KB3页124
IC封装资料_电容_CL10C562JB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12136316.41 KB3页279
IC封装资料_电容_CL10C562JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-1253259.58 KB3页212
IC封装资料_电容_0805B474K250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-125591.05 MB27页141
IC封装资料_电容_C1005X5R1E225K050BC.pdf
February2019MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[020...
2024-12-121881.65 MB57页227
IC封装资料_电感_SWPA252012S2R2MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-125601.32 MB22页67

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